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UV glue formed by coining of micro-namometer structure

A nano-structure and nano-imprinting technology, applied in the direction of adhesives, non-polymer organic compound adhesives, etc., can solve the problems of low success rate of transcription and inability to complete large-area molding at one time, and achieve fast pattern production and repetition rate. High, improve the effect of product yield

Inactive Publication Date: 2013-06-19
金甲化工企业(中山)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a 100% solid content micro / nanostructure imprinting UV glue suitable for roll-to-roll (R2R) imprinting equipment, so as to solve the problem that the existing lithography technology cannot complete large-scale printing at one time. The problem of low success rate of area forming and transcription

Method used

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  • UV glue formed by coining of micro-namometer structure
  • UV glue formed by coining of micro-namometer structure
  • UV glue formed by coining of micro-namometer structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] 1. Prepare raw materials according to the following weight percentages:

[0017] Polyester acrylate oligomer 35%, pure acrylic oligomer 19%, 1,6 hexanediol diacrylate 18%, tripropylene glycol diacrylate 16%, 1-hydroxycyclohexyl phenyl ketone 12%

[0018] 2. Specifically, prepare according to the following process:

[0019] First, dissolve 1-hydroxycyclohexyl phenyl ketone with 1,6 hexanediol diacrylate and tripropylene glycol diacrylate;

[0020] Then add polyester acrylate oligomer and pure acrylic oligomer;

[0021] Finally, it can be obtained after stirring and filtering by a high-speed mixer.

Embodiment 2

[0023] Polyester acrylate oligomer 50%, pure acrylic oligomer 10%, 1,6 hexanediol diacrylate 18%, tripropylene glycol diacrylate 15%, 1-hydroxycyclohexyl phenyl ketone 7%

[0024] The preparation process is consistent with the examples.

Embodiment 3

[0026] Polyester acrylate oligomer 50%, pure acrylic oligomer 20%, 1,6 hexanediol diacrylate 15%, tripropylene glycol diacrylate 10%, 1-hydroxycyclohexyl phenyl ketone 5%

[0027] The preparation process is consistent with the examples.

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Abstract

The invention discloses UV glue formed by coining of a micro-namometer structure and a preparation method of the UV glue. The UV glue comprises the following components according to the following weight percentage: 30-46% of polyester acrylic ester low polymers, 13-19% of pure acrylic acid low polymers, 11-18% of 1,6 hexanediol diacrylic ester, 9-16% of tripropylene glycol diacrylic ester and 7-12% of 1-hydroxyl cyclohexyl phenyl ketone. The 1,6 hexanediol diacrylic ester and the tripropylene glycol diacrylic ester are used for dissolving the 1-hydroxyl cyclohexyl phenyl ketone, then the polyester acrylic ester low polymers and the pure acrylic acid low polymers are added to obtain a mixture, and at last, a high-speed blender is used for stirring and filtering the mixture to obtain the UV glue. The UV glue can be formed in a large area, is high in success rate of transfer and especially suitable for reel-to-reel coining equipment to conduct low-cost and continuous production, and can be widely used in the production technology of large-area pliability display substrates, anti-reflection nano-optics films, ultra-thin large-area light guide plates, micro-spectrometers, sub-wavelength optical modules, biomedical chips and other high-tech products.

Description

technical field [0001] The invention relates to a UV glue, in particular to a micro / nano structure embossed UV glue used in the lithography forming process of the roll-to-roll (R2R) process. The invention also discloses the micro / nano structure imprint The preparation method of forming UV glue. Background technique [0002] The existing imprint lithography technology generally uses materials such as PMMA or PS as the resist, and the resist reaches the conversion temperature by heating. When the master mold and the resist are completely sealed, the temperature is lowered to solidify the resist, and finally Separate the master pattern from the resist. With this production process, since large-area molding cannot be completed at one time, the operation is very time-consuming, and the success rate of transfer is not high, which cannot meet the requirements of high-efficiency imprinting processes such as roll-to-roll (R2R), resulting in imprinting costs. High, low mass producti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02
Inventor 林英照
Owner 金甲化工企业(中山)有限公司