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Tinning solution

A technology of tin plating solution and stannous chloride, which is applied in the field of electroplating chemistry, can solve problems such as easy blackening, growth of whiskers, affecting product quality and performance, etc., so that it is not easy to blacken, difficult to grow whiskers, and the product can good solderability

Inactive Publication Date: 2013-06-19
顾向军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The popularization of electronic products has increased the demand for lead-type electronic components. In order to improve the weldability and conductivity of electronic components, the leads of electronic components need to be tinned. Affect product quality and performance

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0009] A tin plating solution, that is, the formula by weight ratio is: stannous chloride 25g / L, hydrochloric acid 150g / L, bismuth nitrate 5g / L, complexing agent 150g / L, stabilizer 60g / L, brightener 5g / L, the balance deionized water. The complexing agent is an aqueous solution of hydroxyethylene diphosphonic acid, tripotassium citrate and boric acid, the stabilizer is an aqueous solution of sodium hypophosphite and polyethylene glycol, and the brightener is an aqueous solution of polyoxyethylene fatty alcohol ether and Dilute solution of methanol.

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PUM

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Abstract

The invention discloses a tinning solution. The tinning solution comprises, by weight, 20-50g / L of stannous chloride, 150-250g / L of hydrochloric acid, 5-10g / L of bismuth nitrate, 120-180g / L of complexing agent, 50-100g / L of stabilizer, 5-15g / L of brightener, and the rest of the tinning solution is deionized water. The complexing agent is an aqueous solution including hydroxy ethyl phosphonic acid, potassium citrate, and boric acid. The stabilizer is an aqueous solution including sodium phosphate and polyethylene glycol, and the stabilizer is a dilute solution including polyoxyethylene fatty alcohol ether and methanol. The tinning solution is reasonable in formula, stable in performance of the plating solution, capable of enabling products with a tin bismuth alloy coating not prone to bluing and growing whiskers, and good in weldability of products.

Description

Technical field [0001] The invention belongs to the technical field of electroplating chemistry, and specifically relates to a tin plating solution. Background technique [0002] The popularity of electronic products has increased the demand for lead-type electronic components. In order to improve the solderability and conductivity of electronic components, the leads of electronic components need to be tinned, but the current plating time is prone to black and whisker growth. Affect product quality and performance. Summary of the invention [0003] The purpose of the present invention is to provide a tin plating solution with reasonable formula, stable plating solution performance, and high quality products that are not prone to blackening and whisker growth. [0004] The technical solution of the present invention is: [0005] A tin plating solution, which is characterized in that the formula according to weight ratio is: stannous chloride 20-50g / L, hydrochloric acid 150-250g / L, bi...

Claims

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Application Information

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IPC IPC(8): C25D3/30
Inventor 顾向军
Owner 顾向军