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Tinning technique

A tin plating and process technology, applied in the field of electroplating chemistry, can solve problems such as affecting product quality and performance, easy to grow whiskers, heavy pollution, etc., and achieve the effects of preventing electrical conductivity, good weldability, and reasonable process.

Inactive Publication Date: 2013-06-19
蔡成俊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Tin plating on metal plates or wires has good weldability, conductivity and glossiness. The traditional tin plating process has disadvantages such as heavy pollution, unstable plating solution and easy growth of whiskers, which affect product quality and performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] 1. Preparation of tin plating solution: 80g / L of stannous methanesulfonate, 150g / L of methanesulfonic acid, 5g / L of bismuth sulfate, 0.5g / L of catechol, 3g / L of formaldehyde, 5g / L of polyethylene glycol L, balance water.

[0011] 2. Tin plating process:

[0012] 1. Degrease and degrease the tinned steel wire in sequence, put the copper-clad steel wire in a chemical solvent at a temperature of 50°C and soak for 5 minutes 2. Pickling, 3. Washing with running water, 4. Passivation , 5. Tin plating, that is, the copper-clad steel wire after passivation cleaning is immediately put into the tin plating solution at a temperature of 40°C, the transmission speed is controlled at 4m / s, and the current density is controlled at 5a / dm 2 , 6, washing, 7, drying, 8, packaging.

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PUM

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Abstract

The invention relates to a tinning technique. The tinning technique is characterized by comprising the following steps: 1, degreasing and deoiling, 2, acid cleaning, 3, water washing, 4, passivation, 5, tinning, namely, immediately placing passivated and cleaned copper clad steel wires into a tinning solution with temperature of 30-50 DEG C, transmission speed controlled within 2-5m / s, and current density controlled within 2-10a / dm2, 6, water washing, 7, drying, 8, packaging. The tinning technique is reasonable in design and capable of enabling produced products to be good in weldability, electrical conductivity and avoiding growth of whiskers.

Description

technical field [0001] The invention belongs to the technical field of electroplating chemistry, and in particular relates to a tin plating process. Background technique [0002] Tin plating on metal plates or wires has good weldability, conductivity and glossiness. The traditional tin plating process has disadvantages such as heavy pollution, unstable plating solution and easy growth of whiskers, which affect product quality and performance. Contents of the invention [0003] The purpose of the present invention is to provide a tin plating process with reasonable process, and the produced products have better weldability, conductivity and prevention of whisker growth. [0004] The technical scheme adopted in the present invention is: [0005] A kind of tinning process, it is characterized in that: comprise the following steps, 1, degreasing and degreasing, 2, pickling, 3, washing, 4, passivation, 5, tinning, the copper clad steel wire after the passivation cleaning is ab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32C25D5/34C25D7/06
Inventor 蔡成俊
Owner 蔡成俊