Method and device for fabricating self-rotating diamond wire saw

A production method and self-rotation technology, applied in the direction of electrolytic coating, coating, cells, etc., can solve the problems of distribution uniformity and density affecting cutting ability, surface quality, diamond wire production cost, etc., to reduce the probability of wire breakage , diameter fluctuation is well controlled, and the effect of improving surface quality

Inactive Publication Date: 2013-06-26
何建久
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

However, the distribution uniformity and density of diamond particles in the diamond wire production process directly affect the cutting ability and the surface quality of the processed material, and at the same time have a greater impact on the production cost of the diamond wire

Method used

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  • Method and device for fabricating self-rotating diamond wire saw

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Embodiment Construction

[0015] A production equipment for self-rotating electroplating diamond wire saw, including electroplating tank 1, wire inlet hole 2, metal wire 3, diamond particles 4, sand inlet 5 and air outlet 6.

[0016] The pretreated diamond particles 4 are flowed into the electroplating tank 1 through the sand inlet 5, and the gas flow size and the gas flow direction of the gas flow port 6 are adjusted, so that the diamond particles 4 can be evenly rotated in the plating solution of the electroplating tank 1; The current density of the plating solution in the tank 1 reaches the target value, and when the temperature of the plating solution reaches the set value, the movement control device of the metal wire 3 is opened; the metal wire 3 is pulled into the electroplating tank 1 at a constant speed through the wire inlet hole 2, and the metal wire 3 is traveling, through a series of reactions, the diamond particles 4 will be electroplated and solidified on the surface of the wire 3 continu...

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Abstract

The invention relates to the technical field of diamond wire saw fabrication and especially discloses a method and a device for fabricating a self-rotating electroplated diamond wire saw. The method comprises the following steps of: firstly, enabling diamond particles pretreated previously to flow into an electroplating tank via a sand inlet; adjusting the airflow rate and the airflow direction of an airflow port, so that the diamond particles are evenly rotated in electroplating liquid; adjusting the current density of the electroplating liquid in the tank to a target control range, and turning on a metal wire movement control device when the temperature of the electroplating liquid in the tank reaches the target value; controlling the moving speed and the rotation direction of the metal wire and controlling the moving speed of the metal wire in the range of 2-50 m / min; and during the movement of the metal wire, solidifying the diamond particles on the surface of the metal wire evenly. A diamond wire which is even in diamond particle distribution and good in density distribution consistency is obtained through the process of the device; and the diamond wire is then subjected to processes such as thickening and on-line posttreatment.

Description

technical field [0001] The invention relates to the technical field of making diamond wire saws, in particular to a method and equipment for making self-rotating electroplated diamond wire saws. Background technique [0002] In the cutting of hard and brittle materials such as silicon wafers, sapphire and ceramics, diamond wire saws are widely used in the high-end product market due to their unique cutting capabilities. The manufacturing technology of diamond wire used in cutting hard and brittle materials such as silicon wafers and sapphire, especially in solar silicon wafer cutting, is basically mastered in a few developed countries such as Japan. [0003] The electroplated diamond wire is to uniformly coat a layer of diamond particles on the ordinary metal wire, and realize the cutting of hard and brittle materials through the high-efficiency cutting ability of diamond particles. However, the distribution uniformity and density of diamond particles in the diamond wire pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00C25D21/12
Inventor 何建久李毕武祁宏山徐金全祁万章
Owner 何建久
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