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Novel polyamide adhesive

A polyamide hot-melt adhesive, dimerized amine technology, used in adhesives, other chemical processes, chemical instruments and methods, etc.

Active Publication Date: 2013-07-03
SHANGHAI LIGHT IND RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because domestic dimer acid polyamide hot melt adhesives still have high water absorption and brittleness, they have not been widely promoted in these high-end application fields.

Method used

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  • Novel polyamide adhesive
  • Novel polyamide adhesive
  • Novel polyamide adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] With 0.5 mole of sebacic acid, 0.25 mole of dipolyamine (Priamine1074, British Croda Company), 0.05 mole of hexamethylenediamine, 0.125 mole of piperazine, 0.075 mole of polytetramethylene ether diamine (THF-100) and 0.3g Put the antioxidant 1010 into a 1000ml four-necked flask, and raise the temperature to 160°C under the protection of nitrogen; after the components in the bottle are completely dissolved, start to raise the temperature slowly. Raise the temperature to 240°C within 1.5-2 hours; measure the water output; when it reaches more than 80% of the theoretical water output, gradually reduce the pressure; finally complete the entire reaction under high vacuum, and the vacuum reaction time is about 5-10 hours. Then pressurize to normal pressure with nitrogen and stir for half an hour. Finally, pour the polyamide on the surface of the PTFE board while it is hot, cool it and cut it into particles.

[0052] The obtained polyamide hot melt adhesive has a ring and bal...

Embodiment 2～6

[0054] Examples 2-6 refer to the formulations in Table 1 and the above synthesis process to obtain polyamide products.

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Abstract

The invention relates to a polyamide hot melt adhesive and a preparation method thereof. The polyamide hot melt adhesive comprises: (1) a C5-C18 aliphatic dicarboxylic acid copolymerization unit; and (2) a diamine copolymerization unit, which is composed of, based on its total mole number: (a) 20-70 mole% of a C24-C48 dipolyamine copolymerization unit; (b) 0-30 mole% of a C2-C10 aliphatic diamine copolymerization unit; (c) 0-50 mole% of a C4-C8 heterocyclic diamine copolymerization unit; and (d) 5-50 mole% of a poly C1-4 alkylidene ether diamine copolymerization unit. The number average molecular weight Mn of the polyamide hot melt adhesive ranges from 2000 to 30000. The polyamide hot melt adhesive has a moderate softening point, extremely low water absorption and low temperature impact resistance, thus being suitable to serve as a hot melt adhesive.

Description

technical field [0001] The invention relates to an adhesive, especially a polyamide adhesive. Background technique [0002] Polyamide is a kind of high-molecular polymer with amide groups on the main chain of the molecule. They can be made into various plastics, drawn into fibers, and can also be made into films, coatings, adhesives, etc. [0003] There are two main types of polyamides used as adhesives. The higher molecular weight is copolyamide. This type of polyamide hot melt adhesive has excellent resistance to washing and dry cleaning. It is widely used in the bonding of fibers. It is widely used in the textile industry. very big. Another type of polyamide is formed by polycondensation of dimer acid and diamine. It has the advantages of narrow melting point range, fast curing, and excellent adhesive performance. It is currently widely used in shoemaking, automobiles, electronics, and heat shrinkable materials. [0004] There have been many studies on polyamide adhesiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/06C09K3/10C08G69/40
Inventor 孙静顾庆锋
Owner SHANGHAI LIGHT IND RES INST
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