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Cutting liquid used for sapphire cutting by diamond wire

A technology of cutting fluid and sapphire, applied in the petroleum industry, lubricating composition, etc., can solve the problems of cutting fluid lubrication, cooling effect can not be ignored, poor slice quality, etc., to improve slice surface quality and yield, easy to clean, excellent The effect of lubrication

Active Publication Date: 2013-07-03
LIAONING OXIRANCHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] It is precisely because of the lack of relevant research that the current slice quality is relatively poor. How to improve the surface quality of the slice should not only start with the quality of the diamond wire saw and the sawing process, but also the lubrication and cooling effects of the cutting fluid during the cutting process.

Method used

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  • Cutting liquid used for sapphire cutting by diamond wire
  • Cutting liquid used for sapphire cutting by diamond wire
  • Cutting liquid used for sapphire cutting by diamond wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Prepare 1000g of cutting fluid, take polyethylene glycol (number average molecular weight 200) 300g, GPE-3000 block polyether 300g, oleic acid triethanolamine 200g, benzotriazole 50g, XPP-7533 silicone defoamer 0.1g , water is about 150g.

[0055] Slowly add polyethylene glycol (number average molecular weight 200), GPE-3000 block polyether, oleic acid triethanolamine, benzotriazole, XPP-7533 silicone defoamer in the water under continuous stirring agent, water. Stir for 10 minutes to obtain sapphire cutting fluid. Its performance indicators are shown in Tables 1 and 2 below.

Embodiment 2

[0057] Prepare 1000g of cutting fluid, take polyethylene glycol (number average molecular weight 400) 300g, PPE-1500 block polyether 300g, oleic acid triethanolamine 200g, benzotriazole 30g, XPP-7533 silicone defoamer 0.1g , the water is about 170g.

[0058] Slowly add the above-mentioned amount of polyethylene glycol (data molecular weight 400), PPE-1500 block polyether, oleic acid triethanolamine, benzotriazole, XPP-7533 silicone defoamer in the water under continuous stirring ,water. Stir for 10 minutes to obtain sapphire cutting fluid. Its performance indicators are shown in Tables 1 and 2 below.

Embodiment 3

[0060] Prepare 1000g of cutting fluid, take polyethylene glycol (number average molecular weight 1000) 200g, GPE-3000 block polyether 250g, oleic acid triethanolamine 150g, benzotriazole 10g, ZBH-305 polyether defoamer defoaming Agent 0.1g, water is about 390g.

[0061] Slowly add polyethylene glycol (number average molecular weight 200), GPE-3000 block polyether, oleic acid triethanolamine, benzotriazole, ZBH-305 polyether defoaming in the water under continuous stirring agent defoamer, water. Stir for 10 minutes to obtain sapphire cutting fluid. Its performance indicators are shown in Tables 1 and 2 below.

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Abstract

The invention relates to water-based cutting liquid used for sapphire cutting, and is suitable for cutting of hard and brittle materials such as sapphire and the like. The cutting liquid of the invention mainly comprises a lubricant, a dispersant, an emulsifier, an antirust agent, and water. The cutting liquid of the invention has excellent lubricity and dispersibility, is easy to clean, can meet requirements for diamond wire high-speed cutting of hard and brittle materials such as sapphire and the like, also provides cut pieces with good surface properties, and can significantly increase product qualified rates.

Description

technical field [0001] The invention relates to a cutting fluid used for cutting hard and brittle material sheets, cubes and blocks, more specifically, the invention relates to a cutting fluid used for diamond wire cutting sapphire. technical background [0002] Sapphire is a general term for corundum gemstones of other colors except ruby, and its main component is aluminum oxide. Due to the wide optical penetration band of sapphire, it has good light transmission from near ultraviolet (190nm) to mid-infrared, and is widely used in optical components, infrared devices, high-strength laser lens materials and mask materials. Because of its high sound velocity, high temperature resistance, corrosion resistance, high hardness, high light transmittance, high melting point (2045°C), etc., it is also often used as a material for optoelectronic components. With the rapid development of products such as LED components and 3G mobile phones, sapphire wafers have become urgently needed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/00C10N40/00C10N30/04C10N30/06C10N30/12
Inventor 朱建民刘兆斌董振鹏仲崇刚周立明杨雪
Owner LIAONING OXIRANCHEM INC