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Phenolic resin composition

A technology of phenolic resin and composition, which is applied in the field of phenolic resin composition, can solve problems such as insufficient heat resistance and poor toughness, and achieve high softening point, enhanced heat resistance and toughness, and low free phenol and volatile content

Active Publication Date: 2015-06-10
江门建滔积层板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional phenolic resins have defects such as insufficient heat resistance and poor toughness.

Method used

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  • Phenolic resin composition
  • Phenolic resin composition

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Embodiment

[0024] The embodiments of the present invention will be described in detail below in conjunction with examples, but those skilled in the art should understand that the following examples are only used to illustrate the present invention and should not be regarded as limiting the scope of the present invention. If specific conditions are not specified in the examples, it is carried out according to conventional conditions.

preparation example

[0026] 1. Component a) Preparation of phenolic resin of the present invention

[0027] Add phenol, formaldehyde, and oxalic acid into the reaction kettle according to the material ratio of 1:0.5:0.02, heat and stir to 100°C, keep the temperature in this temperature range for 4 hours, and then obtain the product by removing phenol by vacuum distillation. The free phenol of the phenolic resin produced in this preparation example is 0.3 wt%.

[0028] 2. Component b of the present invention) Preparation of pyrogallol-divinylbenzene polycondensation resin

[0029] Under the protection of nitrogen, add 27.5g of pyrogallol to a four-necked flask equipped with a stirrer, condenser, constant pressure dropping funnel and thermometer, add 200mL of xylene, 0.75g of oxalic acid, and add 70.0mL1 dropwise after the raw materials are completely dissolved. 3-Divinylbenzene was refluxed at 80°C for 9 hours, the water, solvent and unreacted raw materials were heated to distill until the resin became l...

Embodiment 1

[0031] Under the protection of nitrogen, add 16.0 g of pyrogallol to a four-necked flask equipped with a stirrer, condenser, constant pressure dropping funnel and thermometer. After dissolving completely, add 20.0mL 1,4-divinylbenzene dropwise, and after refluxing at 75℃ for 10h, distill the water, solvent and unreacted raw materials at elevated temperature until the resin becomes liquid to obtain pyrogallol-divinylbenzene polycondensation resin . Then 40.0 g of the phenolic resin prepared in Preparation Example 1 was added to the above four-necked flask, stirred for 10 minutes, and then heated to 130° C., 10.0 g of the curing agent hexamethylenetetramine was added, and the stirring was continued until the mixture was uniform.

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Abstract

The invention relates to a phenolic resin composition. The phenolic resin composition comprises the following components by weight percent: a) 20-70% of phenolic resin; b) 10-40% of pyrogallol-divinyl benzene condensation resin; c) 1-20% of curing agent; and d) 0-40% of addition agent. The phenolic resin composition has favorable heat resistance and toughness, and can be applied to the industries of printing, electronics, coating, printing ink and the like.

Description

Technical field: [0001] The invention relates to a phenolic resin composition, in particular to a phenolic resin composition with excellent heat resistance and toughness. Background technique: [0002] Phenolic resin is one of the earliest industrialized polymer compounds in the world, and it has a history of nearly a hundred years. Because of its easy availability of raw materials, low prices, good molding processability, excellent mechanical properties, flame retardancy and heat resistance, it has become an indispensable raw material for contemporary industry, especially in printing, electronics, coatings and Industries such as ink have been widely used. Traditional phenolic resins have defects such as insufficient heat resistance and poor toughness. Summary of the invention: [0003] In view of the above-mentioned state of the art, the inventors of the present invention have conducted in-depth and detailed research on common phenolic resins and phenolic resins, and developed ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08L61/10C08L65/00C08G61/02C08K13/02C08K5/3477C08K5/3415C08K3/36
Inventor 傅酉付玉生
Owner 江门建滔积层板有限公司