Method for preparing nickel-cubic boron nitride film through ultrasonic electroplating

A cubic boron nitride and ultrasonic technology, applied in electrolytic coatings, coatings, etc., can solve the problems of low content of cubic boron nitride and uneven distribution of cubic boron nitride particles, and achieve uniform powder distribution, firm inlay, The effect of optimizing the plating parameters

Inactive Publication Date: 2013-07-17
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the problems of low content of cubic boron nitride and uneven distribution of cubic boron nitride particles in the nickel-cubic boron nitride film prepared by the existing method, the invention provides a method for preparing nickel-cubic boron nitride film by ultrasonic electroplating method, effectively increasing the content of cubic boron nitride in the nickel-cubic boron nitride film, not only improving the distribution of cubic boron nitride particles in the film, but also improving the bonding strength between the film and the substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The method of preparing nickel-cubic boron nitride film by ultrasonic electroplating, and then put the processed cathode and anode substrate and cubic boron nitride powder into the plating solution for electroplating. During electroplating, ultrasonic waves and ultrasonic power are applied to the plating solution. It is 250W, the frequency is 20KHz, and the current density applied during electroplating is 3A / dm 2 , While stirring the plating solution, the stirring speed is 360r / min, and the temperature of the plating solution is controlled to 40°C.

[0021] After the coating is completed, XRD and SEM scanning analysis: the coating film is relatively uniform, the cubic boron nitride particles are relatively uniformly distributed, a small amount of cubic boron nitride particles agglomerate on the surface, the particles are inlaid firmly, and there is no particle shedding on the surface. At 500μm 2 Observed within a larger area, there is no agglomeration, and the number of cub...

Embodiment 2

[0023] The method of preparing nickel-cubic boron nitride thin film by ultrasonic electroplating. Put the treated cathode and anode substrate and cubic boron nitride powder into the plating solution for electroplating. During electroplating, ultrasonic waves are applied in the plating solution. The power of the ultrasonic is 260W, frequency is 40KHz, current density applied during electroplating is 5A / dm 2 , While stirring the plating solution, the stirring speed is 420r / min, and the temperature of the plating solution is controlled to 60°C.

[0024] After the coating is completed, XRD and SEM scanning analysis: the coating film is relatively uniform, the cubic boron nitride particles are relatively uniformly distributed, a small amount of cubic boron nitride particles agglomerate on the surface, the particles are inlaid firmly, and there is no particle shedding on the surface. At 500μm 2 Observed within the area of ​​??, no agglomeration points were found, and there were 145 cubi...

Embodiment 3

[0026] The method of preparing nickel-cubic boron nitride thin film by ultrasonic electroplating. Put the treated cathode and anode substrate and cubic boron nitride powder into the plating solution for electroplating. During electroplating, ultrasonic waves are applied in the plating solution. The power of the ultrasonic is 255W, frequency is 30KHz, current density applied during electroplating is 4A / dm 2 , While stirring the plating solution, the stirring speed is 390r / min, and the temperature of the plating solution is controlled to 50℃.

[0027] After the coating is completed, XRD and SEM scanning analysis: the coating film is relatively uniform, the cubic boron nitride particles are relatively uniformly distributed, a small amount of cubic boron nitride particles agglomerate on the surface, the particles are inlaid firmly, and there is no particle shedding on the surface. At 500μm 2 Observed within the area, no agglomeration points were found, and there were 280 cubic boron n...

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Abstract

The invention discloses a method for preparing a nickel-cubic boron nitride film through ultrasonic electroplating. The method comprises the following steps of: cleaning cathodic and anodic base materials and cubic boron nitride powder; then putting the treated cathodic and anodic base materials and cubic boron nitride powder into a plating solution for electroplating; and applying ultrasonic waves to the plating solution in an electroplating process. The ultrasonic waves are introduced and electroplating parameters are optimized when the nickel-cubic boron nitride film is prepared through an ultrasonic electroplating method, so that the nickel-cubic boron powder in the nickel-cubic boron nitride film produced by the electroplating method is uniformly distributed, and no agglomeration is caused; and moreover, a nickel layer in the film is also relatively smooth, and the nickel-cubic boron powder does not generate the agglomeration in the film and is firmly embedded.

Description

Technical field [0001] The invention relates to the field of preparation of nickel-cubic boron nitride films, in particular to a method for preparing nickel-cubic boron nitride films by ultrasonic electroplating. Background technique [0002] Cubic boron nitride (cBN) is a new type of semiconductor material, with excellent physical and chemical properties, such as high hardness, high thermal conductivity, wide band gap, high thermal stability and chemical stability, suitable for iron-based alloy tool coating . [0003] The typical physical vapor deposition methods for preparing cubic boron nitride films mainly include sputtering, ion plating and pulsed laser deposition. The chemical methods mainly include radio frequency glow discharge plasma CVD, hot wire assisted radio frequency glow discharge plasma CVD, and electron cyclotron resonance CVD etc. Although scientific researchers have used various physical vapor deposition and chemical deposition methods to prepare cubic boron ni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/20C25D15/00
Inventor 姚怀刘雅琴杜三明刘伟苌清华
Owner HENAN UNIV OF SCI & TECH
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