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A New High Speed ​​Prescaler Circuit

A pre-frequency division circuit and high-speed technology, applied in the field of radio frequency communication, can solve the problems of low operating frequency, poor stability, and small application range, and achieve the effect of wide frequency division range and high self-oscillation frequency

Active Publication Date: 2016-02-10
杭州中科微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the defects of low operating frequency, poor stability and small application range in the prior art, and disclose a new type of high-speed prescaler circuit. Two amplitude and phase current shaping units are added to the circuit to achieve a higher operating frequency and a wider frequency division range, while retaining the advantage of a stable DC working state

Method used

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  • A New High Speed ​​Prescaler Circuit
  • A New High Speed ​​Prescaler Circuit
  • A New High Speed ​​Prescaler Circuit

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0058] Figure 4 A block diagram of the circuit configuration of the high-speed prescaler circuit of the first embodiment of the present invention is given. As shown in the figure: the first current mode logic latch 41 is composed of an input pair of transistors 1 , a sampling pair of transistors 1 , a load pair of transistors 1 and a latch pair of transistors 1 . The second current mode logic latch 42 is composed of an input pair of transistors 2 , a sampling pair of transistors 2 , a load pair of transistors 2 and a latch pair of transistors 2 . The QN terminal and the QP terminal of the first current-mode logic latch are reversely connected to the IN terminal and the IP terminal of the second current-mode logic latch. The connection point between the input pair tube 1 of the first current mode logic latch 41 and the sampling pair tube 1 is the source common mode point P11 of the sampling pair tube, and the input pair tube 2 of the second current mode logic latch 42 is conn...

no. 2 example

[0060] Figure 5a It is a tube-level circuit configuration diagram of the high-speed prescaler circuit of the embodiment of the present invention. like Figure 5aShown: The circuit composition of the first current mode logic latch includes the clock input pair M11-M12, the sampling pair M15-M16, the latch pair M17-M18, the equivalent load resistance pair M113-M114 and the current source I11; the circuit configuration of the second current mode logic latch includes clock input pair tubes M13-M14, sampling pair tubes M19-M110, latch pair tubes M111-M112, equivalent load resistance pair tubes M115-M116 and current source I12 . The first current-mode logic latch and the second current-mode logic latch are reversely connected, and the equivalent load resistance transistors M113-M116 of the two current-mode logic latches work in a linear region. The gates of the M11 and M14 tubes are connected in parallel to the positive-phase clock signal CLKP, and the gates of the M12 and M13 t...

no. 3 example

[0067] like Figure 5b The block diagram of the high-speed prescaler circuit using the current shaping technology involved in the given third embodiment is shown as a variant of the second embodiment, which uses MIM (Metal-insulator-Metal) capacitors in the integrated circuit manufacturing process.

[0068] like Figure 5b As shown, the circuit configuration of the first current mode logic latch includes clock input tubes M21-M22, sampling pair tubes M25-M26, latch pair tubes M27-M28, which are equivalent to load resistors M213-M214; the second current mode The circuit composition of the logic latch includes clock input tubes M23-M24, sampling pair tubes M29-M210, latch pair tubes M211-M212, equivalent load resistors M215-M216, and M213-M216 that can be equivalent to load resistors work online sex zone. The two current-mode logic latches are connected in reverse. The gates of M21 and M24 are connected in parallel to the positive-phase clock signal CLKP, the gates of M22 and...

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Abstract

The invention discloses a new type high speed prescale circuit which comprises two current mode logic latches (D-Latch) and two MIM (Metal Injection Molding) capacitors or two MOS (Metal Oxide Semiconductor) pipe capacitors which achieve a current shaping function. An MOS sampling tube source common mold point of each of the two D-Latches is respectively connected with an amplitude phase current shaping unit to change amplitudes and phases of sampling tube current ID under a large signal operation state and enlarge phase shift theta which needs to be compensated through a load RC (Remote Control) network and accordingly a higher self-oscillation frequency is obtained and the high speed pre-frequency dividing circuit is provided with a higher working efficiency and a wider frequency-dividing range. The new type high speed prescale circuit is capable of being widely applied to a phase-locked loop module or a related module of a frequency synthesizer in the radio frequency identification field.

Description

technical field [0001] The invention belongs to the technical field of radio frequency communication, and relates to a high-speed and low-power prescaler circuit applying current shaping technology, in particular to a novel high-speed prescaler circuit, which is applied to a frequency synthesizer of a wireless communication radio frequency chip and provides high-performance Prescaler circuit for frequency sensitivity curve. Background technique [0002] With the continuous maturity and improvement of Wi-Fi, Bluetooth, 3G, LTE and other communication standards, wireless communication RF chips can be seen everywhere in our lives. For wireless communication chips, it is necessary to generate an accurate and stable local oscillator signal inside the chip. This function is usually completed by a frequency synthesizer. The prescaler circuit is a core module of the frequency synthesizer and works in the whole chip. Maximum operating frequency. In the application of RF chips, it i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03K23/52H03K19/094
Inventor 石坚钱敏甘业兵金玉花乐建连
Owner 杭州中科微电子有限公司
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