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TOP-LED packaging device and preparation method thereof

A technology for TOP-LED and packaged devices, which is applied in the field of TOP-LED packaged devices and its preparation, can solve the problems of increasing production costs, increasing inventory, and reducing the concentration of SMD product color areas, so as to improve the bonding strength and improve The effect of safe and reliable performance

Active Publication Date: 2013-07-24
LEDMAN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With this traditional glue dispensing process, the amount of glue in each bracket cup cannot be precisely controlled, resulting in a decrease in the concentration of the color area of ​​the SMD product, and the light shape of the SMD product is different, which increases the inventory and increases the production cost.

Method used

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  • TOP-LED packaging device and preparation method thereof
  • TOP-LED packaging device and preparation method thereof
  • TOP-LED packaging device and preparation method thereof

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preparation example Construction

[0041] see figure 2 , the preparation method of the TOP-LED encapsulation device of an embodiment, comprises the following steps:

[0042] Step S100 , fixing the LED chip at the bottom of the holder cup of the SMD holder.

[0043] see image 3 After the SMD bracket 110 is dehumidified, the LED chip 120 is fixed at the bottom of the bracket cup 112 with a crystal-bonding primer.

[0044] Step S200, electrically connecting the LED chip to the SMD bracket.

[0045] The electrodes of the LED chip 120 are connected to the SMD bracket 110 through wires 130 , and a wire bonding machine is used to perform wire bonding to form a wire-bonded SMD bracket.

[0046] Step S300 , spraying a primer diluted with an organic solvent on the inner wall of the bracket bowl, and after the organic solvent in the primer volatilizes, an SMD bracket containing a primer layer is formed.

[0047] The primer is sprayed on the inner wall of the bracket cup 112 , and the primer layer 140 is formed after t...

Embodiment 1

[0063] A method for preparing a TOP-LED packaging device, comprising the following steps:

[0064] 1. Fix the LED chip at the bottom of the bracket cup of the SMD bracket.

[0065] see image 3 , The SMD bracket 110 is a TOP type SMD3528 bracket, and the top of the inner wall of the bracket cup 112 is provided with a glue injection hole 112a.

[0066] 2. Electrically connect the LED chip to the SMD bracket.

[0067] 3. Spray the primer diluted with organic solvent on the inner wall of the bracket bowl, and after the organic solvent in the primer volatilizes, an SMD bracket with a primer layer is formed.

[0068] The material of the primer is a polysiloxane primer, which consists of 26.5 parts of the partially hydrolyzed product of tetraethoxysilane, 27.5 parts of tetrabutyl titanate, 18.5 parts of silicone MQ resin soluble in toluene, 10 1,2-bistriethoxysilylethane mixed in 330 parts hydrocarbon solvent.

[0069] 4. Put the SMD bracket containing the primer layer into the ...

Embodiment 2

[0077] A method for preparing a TOP-LED packaging device, comprising the following steps:

[0078] 1. Fix the LED chip at the bottom of the bracket cup of the SMD bracket.

[0079] see Figure 4 , The SMD bracket 310 is a TOP-SMD3535 ceramic bracket.

[0080] 2. Electrically connect the LED chip to the SMD bracket.

[0081] 3. Spray the primer diluted with organic solvent on the inner wall of the bracket bowl, and after the organic solvent in the primer volatilizes, an SMD bracket with a primer layer is formed.

[0082] The material of the primer is a polysiloxane primer, which is specifically composed of 10 parts of polymethylhydrogensiloxane, 4.95 parts of vinyltrimethoxysilane, 37.8 parts of heptane, converted into a Pt mass fraction of 4×10 -6 Chloroplatinic acid was prepared.

[0083] 4. Put the SMD bracket containing the primer layer into the cavity of the heated and heat-preserved mold, and then seal the mold.

[0084] Wherein, the mold 400 includes an upper mold 4...

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Abstract

The invention provides a TOP-LED packaging device and a preparation method of the TOP-LED packaging device. The TOP-LED packaging device comprises an SMD support, an LED wafer, an undercoat and pouring sealant. The SMD support is electrically connected with the LED wafer. A support bowl cup is arranged at one end of the SMD support. The LED wafer is arranged at the bottom of the interior of the support bowl cup. The undercoat is arranged on the inner wall of the support bowl cup. The interior of the support bowl cup is filled with the pouring sealant. Due to the fact that the undercoat is arranged on the inner wall of the support bowl cup of the SMD support, the TOP-LED packaging device has the advantages of being capable of improving bonding strength between the SMD support and the pouring sealant, being beneficial to long-term using stability, and improving safety performance and reliable performance.

Description

technical field [0001] The invention relates to the field of light-emitting diodes, in particular to a TOP-LED packaging device and a preparation method thereof. Background technique [0002] TOP-LED (top-emitting LED) is a kind of patch-type light-emitting diode (SMD-LED). Because of its bracket structure with a certain optical bowl design, it has the characteristics of large light angle, high luminous efficiency, and long life. Used in lighting, display screens, and backlights and status indicators in multifunctional ultra-thin mobile phones and PDAs (Pocket Computers). [0003] The SMD bracket of TOP-LED is usually injection molded by PPA (polyphthalamide) material and copper, aluminum and other metal skeletons. In terms of full-color or monochrome SMD device packaging, epoxy resin is generally used for potting; for white lighting LED devices, silica gel or silicone resin is generally used for potting. In practical application, the epoxy resin can be closely combined wi...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/56H01L33/54
CPCH01L2224/48091H01L2224/48247H01L2924/00014
Inventor 李漫铁王绍芳屠孟龙李扬林谢振胜
Owner LEDMAN OPTOELECTRONICS
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