Method for realizing blue shift of band gap of semiconductor quantum well structure

A quantum well and semiconductor technology, applied in the field of semiconductor quantum well structure band gap blue shift, can solve problems such as repeatability and stability to be improved, difficult selection control, thermally induced diffusion, etc., to achieve large-scale industrialization and reduce thermal effects. , the effect of improving efficiency and stability

Inactive Publication Date: 2013-08-07
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Problems solved by technology

In this method, gallium is diffused into silicon oxide by depositing a silicon oxide film and high-temperature annealing, and then the diffusion of vacancies is generated to cause quantum well mixing, but the temperature required by this method is too high, and it is not easy to select a region to control;
[0006] (3) Quantum well hybridization is also realized by the method of light. The University of Glasgow has developed the use of continuous Nd:YAG laser heating to drive the inter-diffusion between different barriers and wells in the quantum well structure to achieve quantum well hybridization; subsequently, using pulse width The Nd:YAG laser with a few nanoseconds also realizes quantum well hybridization and device development, but this method has point defect generation and thermally induced diffusion at the same time, and the repeatability and stability need to be improved.

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  • Method for realizing blue shift of band gap of semiconductor quantum well structure
  • Method for realizing blue shift of band gap of semiconductor quantum well structure
  • Method for realizing blue shift of band gap of semiconductor quantum well structure

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[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values ​​may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values ​​within acceptable error margins or design constraints. In addition, the directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring t...

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Abstract

The invention provides a method for realizing blue shift of a band gap of a semiconductor quantum well structure. The method comprises the steps of depositing a surface sacrificial layer on the quantum well structure; selecting a regional surface sacrificial layer through ultrashort pulse laser irradiation or scanning to realize chemical modification or introducing structure defects in the regional surface sacrificial layer to form a laser modified region; and conducting quick thermal annealing to a component comprising the quantum well structure and the surface sacrificial layer, transmitting the chemical modification of the laser modified region or the introduced structure defects into the quantum well structure through a thermal induction effect to enable well / barrier components of the quantum well structure to be mutually mixed to realize the wavelength blue shift of the band gap of the quantum well structure.

Description

technical field [0001] The invention relates to semiconductor optical device and photonic integrated circuit technology, in particular to a method for realizing the bandgap blue shift of semiconductor quantum well structure by using ultrashort pulse laser technology. Background technique [0002] With the continuous development of optical fiber communication, the demand for monolithic integration of various photonic devices continues to increase. The current development of photonic integrated circuits is just like the large-scale electronic integrated circuits that occurred in the 1970s, and will be realized in the future. Larger scale applications. [0003] At present, the biggest difference from microelectronic integrated circuits is that photonic integrated circuits need to form various materials with different band gaps on the same substrate to meet the requirements of various active and passive devices. The detector needs to absorb light, while the waveguide needs to t...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/34
Inventor 黄永光朱洪亮崔晓
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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