Gold-platinum-alladium alloy bonding wire

Abstract

[Problem] To provide a gold-platinum-palladium alloy bonding wire for vehicle-mounted semiconductors, which exhibits excellent reliability in the connection with aluminum pads, while being highly reliable when left at high temperatures even in cases where an epoxy resin containing no halogen substance is used, thereby capable of maintaining the electrical characteristics after being left at high temperatures. [Solution] A gold-platinum-palladium alloy bonding wire which contains 0.4-1.2% by mass of platinum, 0.01-0.5% by mass of palladium, 10-30 ppm by mass of aluminum and 10-60 ppm by mass of calcium and / or magnesium in total, with the balance made up of gold having a purity of 99.999% by mass or more.

Description

technical field [0001] The present invention relates to a gold-platinum-palladium alloy-based bonding wire suitable for connecting substrates such as IC chip electrodes and external leads of semiconductor devices, and particularly relates to a high-temperature bonding wire used in vehicles or high-speed devices. A gold-platinum-palladium alloy bonding wire for sealing with a halogen-free epoxy resin used in an environment. Background technique [0002] At present, as gold alloy wires connecting IC chip electrodes and external leads of semiconductor devices requiring high bonding reliability in automotive applications, high-purity gold containing 0.5 to 1.2 mass% of palladium with a purity of 99% is often used, which is excellent in reliability. The gold-palladium alloy wire of about mass %. One end of this gold alloy wire is connected to the pure aluminum pad or aluminum alloy pad on the electrode of the IC chip by ultrasonic thermocompression wire bonding method, and the o...

AI Technical Summary

Problems solved by technology

However, if the formation of intermetallic compounds is to be suppressed, the diffusion of gold and aluminum in the gold-aluminum junction must be excessively controlled, so the junction strength due to diffusion cannot be sufficiently ensured, and it is considered that the interface will deteriorate at the gold-aluminum junction

Due to this situation, the fact is that gold-palladium alloy bonding wires cannot be practically used in automotive IC packages and semiconductor devices using epoxy sealing resins that do not contain halogen substances.

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