EVA packaging adhesive film for resisting potential-induced degradation of photovoltaic module
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A technology of potential-induced attenuation and encapsulation film, which is applied in photovoltaic power generation, circuits, adhesives, etc., can solve limitations and other problems, achieve the effect of weakening influence, reducing mobility, and simple method
Active Publication Date: 2013-08-21
JIANGSU LUSHAN PHOTOVOLTAIC TECH
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[0005] For the EVA film, increasing its volume resistance can reduce the wet leakage current of the module, which has a certain effect on improving the anti-PID performance of the
Method used
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Embodiment 1
[0030]Add 0.2 parts of tert-butylperoxycarbonate-2-ethylhexyl, 0.5 parts of tris(nonylphenyl)phosphite, 0.1 parts of 2-hydroxy- 4-n-octyloxybenzophenone, 0.5 part 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, 0.1 part vinyltris(β-methoxyethoxy ) silane, 0.1 part Zr(HPO 4 ) 2 ·H 2 O, mixed evenly by a mixer, put into a casting machine, at 80°C, plasticized, extruded, stretched, drawn, and rolled to make an EVA film with a thickness of about 0.45mm.
Embodiment 2
[0032] Add 1.5 parts of tert-butyl peroxycarbonate-2-ethylhexyl, 0.1 parts of tris(nonylphenyl)phosphite, 0.5 parts of 2-hydroxy- 4-n-octyloxybenzophenone, 0.1 part 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, 1.0 part vinyltris(β-methoxyethoxy ) silane, 1 part Zr(HPO 4 ) 2 ·H 2 O, mixed evenly by a mixer, put into a casting machine, at 80°C, plasticized, extruded, stretched, drawn, and rolled to make an EVA film with a thickness of about 0.45mm.
Embodiment 3
[0034] Add 1.0 parts of tert-butyl peroxycarbonate-2-ethylhexyl, 0.3 parts of tris(nonylphenyl)phosphite, 0.3 parts of 2-hydroxy- 4-n-octyloxybenzophenone, 0.2 parts 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, 0.5 parts vinyltris(β-methoxyethoxy ) silane, 0.3 parts Zr(HPO 4 ) 2 ·H 2 O, mixed evenly by a mixer, put into a casting machine, at 80°C, plasticized, extruded, stretched, drawn, and rolled to make an EVA film with a thickness of about 0.45mm.
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Abstract
The invention discloses an EVA packaging adhesive film for resisting potential-induced degradation (PID) of a photovoltaic module. The adhesive film is mainly used in the field of photovoltaic module packaging. The EVA packaging adhesive film for resisting potential-induced degradation of a photovoltaic module is prepared from the following raw materials: by weight, 100 parts of ethene-vinyl acetate copolymer, 0.2-1.5 parts of an initiator, 0.1-0.5 part of an anti-oxidant, 0.1-0.5 part of an ultraviolet absorber, 0.1-0.5 part of a light stabilizer, 0.1-1.0 part of a tackifier, and 0.1-1 part of a metal ion capture agent. According to the EVA packaging adhesive film for resisting potential-induced degradation of the photovoltaic module, by adding the metal ion capture agent into a common EVA packaging adhesive film, mobility of metal ions is reduced, and the anti-PID characteristic of the photovoltaic module is raised from the source. In addition, the method is simple and the cost is low, so as to help further popularization of a photovoltaic product.
Description
technical field [0001] The invention relates to an EVA adhesive film, in particular to an EVA encapsulation adhesive film resistant to potential potential-induced degradation (PID) of photovoltaic modules, and the adhesive film is mainly used in the field of photovoltaic module encapsulation. Background technique [0002] The full name of PID is Potential-induced degradation (Potential-induced degradation), which was first discovered by Sunpower in 2005. It means that under the action of high voltage, there is a leakage current between the glass and the packaging material, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface and leads to a sharp drop in the photoelectric conversion efficiency of the photovoltaic module. The decline can reach 80-90%. [0003] From the perspective of the power attenuation mechanism of the cell, there are currently three main reasons: one is that the forward bias of ...
Claims
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