Preparation method of indium tin oxide rotary target material

Abstract

The invention relates to a preparation method of an indium tin oxide rotary target material. The preparation method comprises the following steps of filling indium tin oxide powder obtained by a chemical coprecipitation method into a tube-shaped flexible mold, carrying out cold isostatic pressing molding under the pressure of 200 to 400MPa, then reducing the pressure to ordinary pressure so that a indium tin oxide tube-shaped blank is obtained, carrying out degreasing of the indium tin oxide tube-shaped blank in a degreasing furnace, putting the degreased blank into a pressure sintering furnace, and carrying out pressure sintering under the oxygen pressure according to a certain sintering condition to obtain the indium tin oxide rotary target material having relative density more than 99%. The indium tin oxide rotary target material has the advantages that in sputtering, the indium tin oxide rotary target material can rotate around a fixed bar-shaped magnet assembly so that 360 degrees of the target surface can be uniformly etched; and sputtered atoms can flight along all directions so that good uniformity is realized, a sputtering area is increased, replacement is convenient, production efficiency is high and a target material utilization rate is more than 80%.

Description

technical field [0001] The invention relates to a method for preparing an indium tin oxide rotating target. Background technique [0002] ITO film has the dual advantages of transparency and conductivity, and is one of the basic materials in many industries. Therefore, it is widely used in solar cells, liquid crystal displays and plasma displays. It is excellent in LCD, anti-frost, anti-fog, anti-infrared heat insulation surface essential material. In recent years, with the rapid development of high-end display devices, the demand for ITO thin films has also increased sharply. At present, planar ITO targets are widely used in the industry for coating, and the shapes of planar ITO targets include cuboids, cubes, cylinders and irregular shapes. The cuboid, cube and cylinder targets are solid. During the sputtering process, the circular permanent magnet establishes a circular magnetic field on the target surface and forms an etching area on the circular surface with equal dis...

AI Technical Summary

Problems solved by technology

The cuboid, cube and cylinder targets are solid. During the sputtering process, the circular permanent magnet establishes a circular magnetic field on the target surface and forms an etching area on the circular surface with equal distances between the axes. The disadvantage is that the thickness of the film deposition is uniform. The property is not easy to control, the utilization rate of the target is low, only 20% to 30%, and the uniformity of the etching target is poor

The utilization rate of ITO rotating targets can reach more than 80%, and at present, there are few manufacturers at home and abroad that can produce qualified ITO rotating targets, and most of them are in the research and development stage.

Images