Preparation method of indium tin oxide rotary target material

Abstract

The invention relates to a method for preparing an indium tin oxide rotating target, which comprises the following steps: loading indium tin oxide powder obtained by a chemical co-precipitation method into a tubular flexible mold, performing cold isostatic pressing at a pressure of 200-400 MPa, and cold etc. After the static pressure is over, the pressure is released to normal pressure to obtain the indium tin oxide tubular green body, and then the indium tin oxide tubular green body is degreased in the degreasing furnace, and then the degreased green body is put into the pressure sintering furnace, and pressed Under certain sintering conditions, pressure sintering is carried out under oxygen pressure to obtain an indium tin oxide rotating target with a relative density above 99%. The indium tin oxide tubular rotating target prepared by the present invention has the advantage that the target can rotate around the fixed strip magnet assembly during the sputtering process, so that the 360° target surface can be uniformly etched, and the sputtered atoms can be sputtered to each Directional flight, good uniformity, large sputtering area, easy replacement operation, high production efficiency, and high target utilization (>80%).

Description

technical field [0001] The invention relates to a method for preparing an indium tin oxide rotating target. Background technique [0002] ITO film has the dual advantages of transparency and conductivity, and is one of the basic materials in many industries. Therefore, it is widely used in solar cells, liquid crystal displays and plasma displays. It is excellent in LCD, anti-frost, anti-fog, anti-infrared heat insulation surface essential material. In recent years, with the rapid development of high-end display devices, the demand for ITO thin films has also increased sharply. At present, planar ITO targets are widely used in the industry for coating, and the shapes of planar ITO targets include cuboids, cubes, cylinders and irregular shapes. The cuboid, cube and cylinder targets are solid. During the sputtering process, the circular permanent magnet establishes a circular magnetic field on the target surface and forms an etching area on the circular surface with equal dis...

AI Technical Summary

Problems solved by technology

The cuboid, cube and cylinder targets are solid. During the sputtering process, the circular permanent magnet establishes a circular magnetic field on the target surface and forms an etching area on the circular surface with equal distances between the axes. The disadvantage is that the thickness of the film deposition is uniform. The property is not easy to control, the utilization rate of the target is low, only 20% to 30%, and the uniformity of the etching target is poor

The utilization rate of ITO rotating targets can reach more than 80%, and at present, there are few manufacturers at home and abroad that can produce qualified ITO rotating targets, and most of them are in the research and development stage.

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