Biodegradable flexible conductive base plate and preparation method thereof
A flexible conductive and rigid substrate technology, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of environmental and biological hazards, high price, heavy weight, etc., to reduce solid pollution, simple preparation process, high flatness effect
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Embodiment 1
[0031] Such as figure 1 As shown, the biodegradable flexible substrate 1 of the substrate is silk fibroin, the conductive layer 2 is carbon nanotubes, and the thickness of the conductive layer is 200 nm. The entire device structure is described as:
[0032] Silk Fibroin / Carbon Nanotubes
[0033] The preparation method is as follows:
[0034] ① Use acetone, ethanol solution and deionized water to ultrasonically clean the surface of the glass substrate with a surface roughness less than 1 nm, and dry it with dry nitrogen after cleaning.
[0035] ② Prepare the conductive layer of carbon nanotubes by spin-coating, the spin-coating speed is 1000 rpm, the duration is 30s, the film thickness is 200 nm, and then the substrate is thermally annealed at 130°C;
[0036] ③The silk fibroin solution with a concentration of 10 wt% was drip-coated on the glass substrate, and the substrate was heated to 60°C to dry the solution.
[0037] ④ Peel off the dried biodegradable flexible conductiv...
Embodiment 2
[0040] Such as figure 1 As shown, the substrate is a biodegradable flexible substrate 1 viral cellulose, the conductive layer is silver nanowires, and the thickness of the conductive layer is 180 nm. The entire device structure is described as:
[0041] Viral Cellulose / Silver Nanowires
[0042] The preparation process is similar to Example 1.
Embodiment 3
[0044] Such as figure 1 As shown, the biodegradable flexible substrate 1 of the substrate is gelatin, the conductive layer 2 is gold nanowires, and the thickness of the conductive layer is 160 nm. The entire device structure is described as:
[0045] Gelatin / gold nanowires
[0046] The preparation process is similar to Example 1.
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