Preparation method of seamlessly integrated metal substrate/nanoporous metal/metal oxide composite electrode material, and application of compound electrode material
A metal substrate, nanoporous technology, applied in hybrid capacitor electrodes, battery electrodes, circuits, etc., can solve problems such as capacity reduction, electronic conduction and ion diffusion obstacles, electrode failure, etc., to achieve accelerated kinetic characteristics and excellent electrochemical performance. , Excellent effect of larger size
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[0037] The preparation process and steps in this embodiment are as follows:
[0038] (1) A preparation method of a seamlessly integrated metal substrate / nanoporous copper electrode material: deposit Cu with a thickness of 800 nm on the substrate copper foil by magnetron sputtering at room temperature 30 mn 70 (Atomic ratio) alloy film, the size of copper foil is 3cm*2cm*15μm, the sputtering power is 200W, and the time is set for 20min; before the physical deposition of the base copper foil, it is sequentially deposited in 1M HCl solution and deionized water (18.6MΩ·cm) Wash thoroughly with ethanol. Then, at room temperature, the Cu 30 mn 70 The alloy film was chemically dealloyed in 10 mM HCl solution for 5 hours to obtain a copper substrate / nanoporous copper structure; finally, the residual acid in the nanoporous copper was removed by rinsing with deionized water.
[0039] (2) Seamlessly integrated substrate / nanoporous copper / MnO 2 Preparation method of composite electro...
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