Preparation method of modified phenolic resin

A phenolic resin, modified technology, applied in the field of preparation of modified phenolic resin, can solve the problems of heat resistance, limited development of high-performance materials, high brittleness of phenolic resin, etc., and achieve the effect of improving heat resistance and toughness

Inactive Publication Date: 2013-10-23
南京市荣达树脂有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the weak link in the structure of phenolic resin is that the phenolic hydroxyl group and methylene are easily oxidized, and the heat resistance is affected.
Moreover, the traditional unmodified phenolic resin has high brittleness and poor toughness, which greatly limits the development of high-performance materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Modified phenolic resin formula: the molar ratio of phenol and formaldehyde is 1.5:1.0, and the mass of bismaleimide is 0.7 times the total mass of phenol and formaldehyde.

[0020] The preparation method of above-mentioned modified phenolic resin, its preparation comprises the steps:

[0021] (1) Weigh the raw material components according to the formula ratio, put phenol and formaldehyde into the reaction kettle, stir and mix them, then heat up to 80°C.

[0022] (2) Add catalyst, and keep stirring, keep warm for 5 hours.

[0023] (3) Add a prescription amount of bismaleimide to the product obtained in step (2), and stir and mix evenly while adding.

[0024] (4) Adjust the temperature to 80°C and keep it warm for 2 hours.

[0025] (5) Heating to 130°C for dehydration for 0.5 hours, cooling down to below 50°C to obtain the product.

[0026] The modified phenolic resin impact strength that makes in the present embodiment is 12.6kJ / m 2 , the maximum decomposition temp...

Embodiment 2

[0028] Modified phenolic resin formula: the molar ratio of cresol and butyraldehyde is 1.2:1.0, and the mass of bismaleimide is 0.5 times the total mass of cresol and butyraldehyde.

[0029] The preparation method of above-mentioned modified phenolic resin, its preparation comprises the steps:

[0030] (1) Weigh the raw material components according to the formula ratio, put the cresol and butyraldehyde into the reaction kettle, stir and mix them, then heat up to 70°C.

[0031] (2) Add catalyst, and keep stirring, keep warm for 3 hours.

[0032] (3) Add a prescription amount of bismaleimide to the product obtained in step (2), and stir and mix evenly while adding.

[0033] (4) Adjust the temperature to 80°C and keep it warm for 3 hours.

[0034] (5) Heating to 140°C for dehydration for 1 hour, cooling down to below 50°C to obtain the product.

[0035] The modified phenolic resin impact strength that makes in the present embodiment is 12.2kJ / m 2 , the maximum decomposition ...

Embodiment 3

[0037] Modified phenolic resin formula: the molar ratio of bisphenol and acrolein is 1.7:1.0, and the mass of bismaleimide is 1 times the total mass of bisphenol and acrolein.

[0038] The preparation method of above-mentioned modified phenolic resin, its preparation comprises the steps:

[0039] (1) Weigh the raw material components according to the formula ratio, put bisphenol and acrolein into the reaction kettle, stir and mix the two, then heat up to 100°C.

[0040] (2) Add catalyst, and keep stirring, keep warm for 7 hours.

[0041] (3) Add a prescription amount of bismaleimide to the product obtained in step (2), and stir and mix evenly while adding.

[0042] (4) Adjust the temperature to 80°C and keep it warm for 2 hours.

[0043] (5) Heating to 130°C for dehydration for 0.8 hours, cooling down to below 50°C to obtain the product.

[0044] The modified phenolic resin impact strength that makes in the present embodiment is 12.9kJ / m 2 , the maximum decomposition tempe...

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Abstract

The invention discloses a preparation method of a modified phenolic resin. Firstly a phenolic compound is reacted with an aldehyde to generate a phenolic product, then polyimide is added to react with the phenolic product to obtain the modified phenolic resin; and wherein the molar ratio of the phenolic compound to the aldehyde is (1.2-1.7):1.0, and the polyimide accounts for 0.5-1 time by mass of the total amount of the phenolic compound and the aldehyde. Compared with the prior art, the prepared modified phenolic resin is substantially improved in heat resistance and toughness, and thus is adapted to the needs of high and new technology fields such as automobile, electron, aviation, spaceflight, national defense industry and the like.

Description

technical field [0001] The invention relates to a preparation method of resin, in particular to a preparation method of modified phenolic resin. The obtained modified phenolic resin is widely used in high-tech fields such as automobile, electronics, aviation, aerospace and national defense industry. Background technique [0002] Phenolic resin is the first synthetic resin to be industrialized in the world, and it has a history of nearly a hundred years so far. Because of its easy-to-obtain raw materials, low price, simple production process and equipment, and the product has excellent mechanical properties, heat resistance, cold resistance, electrical insulation, dimensional stability, molding processability, flame retardancy and smoke resistance, so It has become an indispensable material in the industrial sector and has a wide range of uses. [0003] However, the weak link in the structure of phenolic resin is that the phenolic hydroxyl group and methylene are easily oxid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/30
Inventor 刘荣春
Owner 南京市荣达树脂有限公司
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