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A composite thermal insulation exterior wall panel

A composite thermal insulation and exterior wall panel technology, applied in building components, buildings, building structures, etc., can solve problems such as hot air flow, unfavorable composite board installation, loss, etc., to improve thermal insulation performance, solve heat loss, and improve thermal insulation. effect of effect

Inactive Publication Date: 2016-03-09
新疆拓新节能新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the three-dimensional composite board also has its defects in terms of heat preservation: such as figure 1 As shown, the common structure of the traditional three-dimensional composite panel (that is, the three-dimensional hollow fabric composite rigid grid in this application) is a sandwich type of "top panel-connecting warp-bottom panel", and the hollow part supported by the connecting warp can be effectively heat transfer from the bottom panel to the top panel; but because the hollow part is through, it is inevitable that hot air will flow and lose in the hollow part, thus weakening the thermal insulation performance of the three-dimensional composite board
However, the wet paste method also has its disadvantages, because the traditional composite board only has a smooth surface
Therefore, when wet pasting, the smooth surface of the composite board and the plaster layer are not easy to form a close and firm contact, which is not conducive to the firm installation of the composite board into the concrete

Method used

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  • A composite thermal insulation exterior wall panel
  • A composite thermal insulation exterior wall panel
  • A composite thermal insulation exterior wall panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] according to figure 2 As shown, the composite thermal insulation exterior wall panel in the present invention is mainly composed of a mother board 1, a sub-board 2 and a foam board 3 respectively pasted on one side panel of the mother board by resin. There are at least two sub-boards and foam boards, and in the embodiment, there are four sub-boards 2 and three foam boards 3 .

[0027] Among them, the main board 1 and the daughter board 2 are mainly cut and made of a three-dimensional hollow fabric composite rigid grid.

[0028] The three-dimensional hollow fabric composite rigid grid is mainly made of three-dimensional three-dimensional fabrics woven from fiber materials impregnated with resin and then cured (basalt fibers are preferred in this embodiment). The three-dimensional fabric is mainly composed of a surface layer woven from basalt fiber yarns, a basalt fiber connecting warp and a back layer woven from basalt fiber yarns. The three-dimensional fabric is wove...

Embodiment 2

[0033] Such as Figure 5As shown, on the basis of the technical solution described in Embodiment 1, the other side panel of the mother board 1 in the direction away from the daughter board 2 is densely covered with third through holes, and an inorganic phase change material insulation layer is bonded by resin 5. After the resin passes through the third through hole, it solidifies on the back of the other side panel of the motherboard 1 to form a coagulation with a diameter larger than that of the third through hole. These coagulations also act as "rivets" similar to the aforementioned "rivets" for anti-delamination role. Of course, it is also possible to directly spray polystyrene particle thermal insulation mortar on the other side panel of the motherboard 1. After the thermal insulation mortar passes through the third through hole, it solidifies on the back of the other side panel of the motherboard 1 to a diameter larger than that of the third through hole. Congealed block...

Embodiment 3

[0036] On the basis of the above embodiments, the motherboard 1 is further improved: the motherboard 1 is composed of two (or more) three-dimensional hollow fabric composite rigid grids that are sequentially laminated and bonded to form the motherboard 1 The three-dimensional hollow fabric composite rigid grid is also densely covered with through holes for resin to pass through on the panels bonded to each other. The two three-dimensional hollow fabric composite rigid grids are bonded by resin, and the resin is solidified on the back of the panel after the through hole under pressure to form a coagulated block with a diameter larger than the diameter of the through hole. These clots lock the two three-dimensional hollow fabric composite rigid grids like "rivets" one by one, which greatly strengthens the anti-delamination ability of the two three-dimensional hollow fabric composite rigid grids after bonding.

[0037] For the technical solutions described in the above embodiment...

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Abstract

The invention relates to a composite thermal insulation external wall board mainly comprising a motherboard, daughter boards and foam boards. The daughter boards and the foam boards are each pasted on one side panel of the motherboard by a bonding agent. The motherboard and the daughter boards are mainly made of three-dimensional hollow fabric composite rigid net racks; the daughter boards and the foam boards are mutually arranged at intervals; through holes are densely distributed on mutually bonded panels of the motherboard and the daughter boards; during bonding, the bonding agent passes through the through holes and is congealed into blocks at the back face of the panels, and the diameter of the blocks is larger than that of the through holes. The daughter boards are spaced apart from each other by the foam boards, so that air in each two daughter boards cannot easily circulate. Therefore, in a manner that hot air is obstructed to flow in hollow parts of the daughter boards, the thermal insulation performance of the external wall board is further improved, and the technical problem that heat loss caused by hot air circulation in a thermal insulation board cannot permanently be solved by the conventional thermal insulation board is solved.

Description

technical field [0001] The invention relates to an exterior wall panel, in particular to a composite thermal insulation exterior wall panel. Background technique [0002] The composite panel made of inorganic fiber three-dimensional fabric represented by basalt fiber after curing not only has the characteristics of light weight and good fire resistance, but also has good sound insulation and heat insulation effect because of the unique hollow structure of the three-dimensional fabric, so It has become a very promising material for making exterior wall panels. [0003] However, the three-dimensional composite board also has its defects in terms of heat preservation: such as figure 1 As shown, the common structure of the traditional three-dimensional composite panel (that is, the three-dimensional hollow fabric composite rigid grid in this application) is a sandwich type of "top panel-connecting warp-bottom panel", and the hollow part supported by the connecting warp can be e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04C2/284E04C2/30
Inventor 林通泉
Owner 新疆拓新节能新材料有限公司
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