Method for manufacturing carbon nano tube flexible micro-bumps through transfer method

Abstract

The invention discloses a method for manufacturing carbon nano tube flexible micro-bumps in microelectronic packaging. According to the method for manufacturing the carbon nano tube flexible micro-bumps, carbon nano tube bundles growing on other substrates are compacted and are transplanted to a semiconductor substrate in a low-temperature transfer manner to obtain flexible micro-bumps. The carbon nano tube bundles have certain elasticity and flexibility, so that the problem of failure caused by thermal stress in interconnection can be solved to a certain extent by manufacturing the flexible micro-bumps through the carbon nano tube bundles. Meanwhile, a carbon nano tube is excellent in electrical performance such as ultrahigh electrical conductivity and current density of over 10<9>A / cm<2>. Therefore, by using the carbon nano tube as micro-bumps, good electrical transmission performance is realized, and the problem of electrical migration of metal bumps can be solved. The method is easy to operate and compatible with a semiconductor process.

Description

technical field [0001] The invention relates to microelectronic packaging technology and micro bump technology, in particular, the invention relates to a method for preparing flexible bumps of carbon nanotubes. Background technique [0002] Flip-chip welding technology is a hybrid integration technology that can facilitate the electrical and mechanical connections between chips. This technology first makes interconnection lead bumps on two chips that need to be interconnected, and then aligns, fuses or bonds these bumps in a dedicated flip-chip bonding device to form an interconnection. Flip-chip packaging technology has the advantages of high precision, small footprint of the formed hybrid integrated chip, high input and output density, short interconnection, and small lead parasitic parameters, which greatly improves the electrical performance and high-frequency performance of the packaged device. In recent years, bump technology in flip-chip soldering has developed rapid...

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Problems solved by technology

[0007] The production method of the present invention can solve the following problems: one is the problem of producing carbon nanotubes in a high-temperature environment (>600°C), so that carbon nanotubes can be used as interconnect materials on active substrates; The problem of the low density of carbon nanotube bundle arrays produced by the deposition method can increase the density of carbon nanotube bundles through two-step densification in the process; the third is to provide a flexible micro-convex carbon nanotube with simple process and compatible with semiconductor manufacturing process. How to make dots

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