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Rolled copper foil

A technology of rolling copper foil and copper foil, which is applied in the field of rolling copper foil, can solve the problems of reduced yield and reduced circuit etching, and achieve the effects of excellent bendability, improved operability, and good etching characteristics

Active Publication Date: 2013-12-11
JX NIPPON MINING & METALS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This depression causes the etchability of the circuit to decrease, or is judged to be defective in the visual inspection, resulting in a decrease in yield.

Method used

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  • Rolled copper foil
  • Rolled copper foil
  • Rolled copper foil

Examples

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Embodiment

[0088] Use copper or copper alloys with the composition shown in Table 1 as raw materials to cast ingots, perform hot rolling at a temperature above 800°C to a thickness of 10 mm, and perform plane cutting of the oxide scale on the surface, then repeat cold rolling and annealing, and finally cool the Finishing during rolling to a thickness of 0.009~0.018mm. The rolling workability in the final cold rolling is 95 to 99.8%. In addition, in Table 1, tough pitch copper is described as TPC, and oxygen-free copper is described as OFC. Oxygen-free copper is oxygen-free copper specified in JIS-H0500 (C1011), and tough pitch copper is tough pitch copper specified in JIS-H0500 (C1100).

[0089] In addition, the final cold rolling was performed in 10 to 15 passes. As shown in Table 1, the surface roughness of the rolls up to the final pass and the surface roughness of the rolls of the final pass were changed to perform rolling. The surface roughness of the rolls from the first pass of the...

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Abstract

[Problem] To provide a rolled copper foil which has a moderately roughened surface whereby the foil has improved handleability, and which has excellent flexibility, is less apt to suffer surface scratches when being handled, and has satisfactory surface etchability. [Solution] A rolled copper foil which has a ratio of the surface roughness (Ra) to the foil thickness (t), Ra / t, of 0.004-0.007. When a 25-[mu]m-long cross-section of the copper foil which extends along a direction parallel to the rolling direction of the copper foil is produced using a focused ion beam and a scanning ion microscope image of the cross-section is examined, then the average value (Lsa) of the depths (Ls) to which shear zones extend in the foil-thickness direction satisfies the following relationship with the thickness (t) of the copper foil: 0.01<=Lsa / t<=0.4.

Description

Technical field [0001] The present invention relates to a rolled copper foil suitable for use in FPCs requiring flexibility. Background technique [0002] The copper foil used in the bending FPC (flexible printed circuit board) requires high flexibility. As a method for imparting flexibility to copper foil, a technique for increasing the orientation degree of the crystal orientation of the (200) plane of the copper foil (Patent Document 1) and increasing the ratio of crystal grains penetrating in the thickness direction of the copper foil are known. The technology (Patent Document 2) and the technology of reducing the surface roughness Ry (maximum height) of the copper foil corresponding to the depth of the oil pit to 2.0 μm or less (Patent Document 3). [0003] The usual FPC manufacturing steps are as follows. First, the copper foil and the resin film are joined. For joining, there are a method of imidization by applying a heat treatment to a varnish applied on a copper foil, a...

Claims

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Application Information

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IPC IPC(8): B21B3/00B21B1/40C22C9/00C22F1/00C22F1/08
CPCB21B3/003C22C9/00C22C9/02C22F1/08B21B1/40B21B3/00
Inventor 中室嘉一郎千叶喜宽大久保光浩鲛岛大辅
Owner JX NIPPON MINING & METALS CO LTD
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