Flux for soldering and solder paste composition

A flux and brazing technology, applied in the field of micro-printable flux, can solve the problems of inability to improve printability, undocumented, difficult to cope with high-density installation, etc., and achieve improved sliding properties, crack prevention, and crack resistance. improved effect

Active Publication Date: 2013-12-18
HARIMA CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in Patent Document 5, there is no description of an acrylic resin comprising, as a monomer, a long-chain alkyl (meth)acrylate having a branched structure such as an isomer.
Therefore, this flux does not improve printability
[0010] As mentioned above, it is difficult for conventional solder paste to cope with the increase in mounting density due to the miniaturization of electronic equipment and the like.

Method used

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  • Flux for soldering and solder paste composition

Examples

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Effect test

Embodiment

[0061] Hereinafter, an Example and a comparative example are given, and this invention is demonstrated concretely. However, the present invention is not limited to these Examples.

Synthetic example 1

[0062] (Synthesis Example 1) Synthesis of thermoplastic acrylic resin

[0063] 30 parts by weight of hexyl carbitol as a solvent was added to a reaction vessel (glass flask) equipped with a thermometer and a nitrogen gas introduction tube, and heated to 90° C. while stirring under a nitrogen atmosphere. Next, 40 parts by weight of isostearyl methacrylate (i-C18), 15 parts by weight of dodecyl methacrylate (C12), and 15 parts by weight of methacrylic acid Tridecyl ester (C13) and 5 parts by weight of azobisisobutyronitrile (AIBN) as a polymerization initiator were mixed to prepare a monomer solution. This monomer solution was dripped into the reaction container over 2 hours, and it reacted at 90 degreeC. After adding all the monomer solutions dropwise, aging was carried out at 90° C. for 2 hours to obtain a thermoplastic acrylic resin (resin A, weight average molecular weight: 15,000).

Synthetic example 2

[0064] (Synthesis example 2) Synthesis of thermoplastic acrylic resin

[0065] As a polymerization initiator, a thermoplastic acrylic resin (resin B, Weight average molecular weight: 15000).

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Abstract

The present invention is a flux for soldering, which contains a base resin and an activator. The base resin contains a thermoplastic acrylic resin that is obtained by polymerizing a monomer component that contains a long-chain alkyl (meth) acrylate. The long-chain alkyl moiety of the long-chain alkyl (meth) acrylate has a branched structure having 12-23 carbon atoms, and the acrylic resin has a weight average molecular weight of 30,000 or less. A solder paste composition of the present invention has improved printability for fine portions without adhering to a squeegee when printed, while having wettability, storage stability and crack resistance in residue portions.

Description

technical field [0001] The present invention relates to a flux for soldering used, for example, when soldering circuit components and the like to a circuit board such as a printed circuit board of an electronic device. In particular, it relates to a flux that improves the fine printability of solder paste in fine parts. Background technique [0002] Conventionally, for soldering circuit components and the like, various solder paste compositions composed of solder powder and flux have been used. [0003] Solder paste application methods are broadly classified into printing methods and discharge methods. The printing method is a method in which a metal mask or a screen with holes in soldered parts is placed on a printed circuit board, and solder paste is applied from above. On the other hand, the dispensing method is a method of applying solder paste position by position to the soldered portion using a dispenser or the like. As far as the fine-pitch pattern is concerned, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/025B23K35/262B23K35/3612H01L2924/00013B23K35/362B23K35/3613
Inventor 井上高辅繁定哲行盐见巧村田雅雄
Owner HARIMA CHEM INC
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