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Light reflecting member for optical semiconductor, and substrate for mounting optical semiconductor and optical semiconductor device using the light reflecting member

An optical semiconductor element and optical semiconductor technology, which are applied in the field of optical semiconductor devices and substrates for mounting optical semiconductors, can solve the problems of increased manufacturing cost, complicated manufacturing methods, etc., and achieve suppression of deformation, high heat resistance and durability, and high brightness. Effect

Inactive Publication Date: 2013-12-25
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the above-mentioned manufacturing method is not only complicated, but also greatly increases the manufacturing cost, and the number of steps in the method is larger than that of a conventional package using thermoplastic resin as a reflector material.

Method used

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  • Light reflecting member for optical semiconductor, and substrate for mounting optical semiconductor and optical semiconductor device using the light reflecting member
  • Light reflecting member for optical semiconductor, and substrate for mounting optical semiconductor and optical semiconductor device using the light reflecting member
  • Light reflecting member for optical semiconductor, and substrate for mounting optical semiconductor and optical semiconductor device using the light reflecting member

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0100]

[0101] (thermosetting resin composition)

[0102] The thermosetting resin composition for forming the resin molded body 1 was produced by melting-mixing the following materials using a planetary gear mixer:

[0103] Triglycidyl isocyanurate: 100 parts by weight

[0104] Hexahydrophthalic anhydride: 165 parts by weight

[0105] Tetrabutyl O, O-diethylphosphine dithiophosphate: 2 parts by weight

[0106] Fused silica (average particle size: 45 μm): 150 parts by weight

[0107] Rutile-type titanium oxide (average particle size: 0.21 μm): 200 parts by weight

[0108] The above thermosetting resin composition is allowed to cool and solidify. The solidified composition is ground into a powder, which is then pressed into small pieces of resin composition. Take advantage of the following conditions figure 1 Mold transfer-molding each resin composition pellet with a cavity conforming to the shape of the desired resin molded body 1 shown in:

[0109] Temperature: 180°...

example 2

[0123]

[0124] On the substrate B for mounting photo-semiconductors, photo-semiconductor elements (TR-5050 produced by Cree. Inc.) were mounted; that is, they were passed through a die attach (produced by Shin-Etsu Chemical Co., Ltd. produced KER-3000-M2) bonded and fixed to the above-mentioned substrate B at prescribed positions in the openings of the respective through-holes 3, and wire-bonded to the wiring through a gold wire (SR-25 produced by Tanaka Kikinzoku Kogyo K.K.) circuit. The groove formed by the via hole 3 and the substrate 4 was filled with an encapsulant (KER- 2500). Therefore, the desired optical semiconductor device C (see Figure 4). Individual optical semiconductor devices corresponding to optical semiconductor elements were produced by cutting the optical semiconductor device C with a blade microtome (DFD6361 manufactured by DISCO Corporation; blade: B1A801-SDC320N50M5154*0.2*40 manufactured by DISCO Corporation).

example 3

[0133]

[0134] A light reflection member A for an optical semiconductor was manufactured in the same manner as in Example 1, and a spacer 19 (PET film MRS50 produced by Mitsubishi Plastics, Inc.) was bonded to the entire surface of the bonding layer 2 containing a white pigment . The silicone resin composition was prepared in the following manner, and by adding 5% by mass of YAG phosphorus (average particle size: 8.9 μm) on the market based on 100 parts by mass of the thus prepared silicone resin composition and using a planetary gear mixer These were mixed to produce a phosphorus-containing silicone resin composition.

[0135] (silicone resin composite)

[0136] The silicone composition was prepared by mixing the following materials and agitating them for 10 minutes at 20°C:

[0137] Dimethylvinylsilane-terminated dimethylpolysiloxane (vinylsilyl group equivalent: 0.071 mol / g): 20 g (vinyl group: 1.4 mmol)

[0138] Trimethylsilyl-terminated dimethylsiloxane-methylhydrid...

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Abstract

The present invention relates to a light reflecting member for an optical semiconductor which makes it possible to manufacture a high-quality optical semiconductor device at a low cost, as well as a substrate for mounting an optical semiconductor and an optical semiconductor device using such a light reflecting member.

Description

technical field [0001] The present invention relates to a light reflective member for an optical semiconductor capable of producing a high-quality optical semiconductor device at low cost, a substrate for mounting an optical semiconductor, and an optical semiconductor device using the light reflective member. Background technique [0002] In recent years, optical semiconductor devices, such as LEDs (Light Emitting Diodes), have been widely used in lighting equipment and as backlights for PC monitors, liquid crystal TV receivers, and the like. Optical semiconductor devices for these purposes are realized in module form, enabling individual SMDs (Surface Mount Devices), such as PLCCs (Plastic Chip Carriers with Leads), to be mounted on circuit boards. [0003] Figure 5A and 5B (along Figure 5A The cross-sectional view of line Y-Y in ) shows the structure of an example of such an SMD package. In this SMD package, an optical semiconductor element 10 is mounted on a lead fram...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60H01L33/48
CPCH01L2224/48091H01L2224/48247H01L2224/45144H01L2933/005H01L2924/00011H01L33/60H01L2924/00014H01L2924/01005H01L33/48H01L33/52
Inventor 福家一浩大薮恭也
Owner NITTO DENKO CORP