Adhesive with ultralow formaldehyde release amount, and preparation method of same

A formaldehyde emission, adhesive technology, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of polluting the environment, damaging human health, high formaldehyde emission, etc., and achieve low free formaldehyde , easy operation and simple preparation process

Active Publication Date: 2014-01-01
GUANGXI SUNWAY FOREST PROD IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide an adhesive with ultra-low formaldehyde emission and its prepara

Method used

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  • Adhesive with ultralow formaldehyde release amount, and preparation method of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A. Add 1000 parts of formaldehyde into the reaction kettle, adjust the pH to 8.7 with 9.3 parts of sodium hydroxide, and add 1.7 parts of polyvinyl alcohol after 10 minutes to form solution A;

[0024] B. When the temperature rises to 30-35°C, add 377 parts of urea and 31.5 parts of melamine to solution A, raise the temperature to 89°C within 55 minutes, and keep the temperature at 88-92°C for 30 minutes to obtain solution B;

[0025] C. Slowly add 7 parts of formic acid to solution B, adjust the pH value to 6.0, and control the temperature at 88-92°C to react, when the viscosity reaches 19.8 seconds / 30°C as the end point, solution C is obtained;

[0026] D. Add 3 parts of triethanolamine to solution C, adjust the pH value to 7.3 with 5.2 parts of sodium hydroxide, add 166 parts of urea and 13.5 parts of melamine, and react at a temperature of 82-85°C for 30 minutes to obtain solution D;

[0027] E. Add 6.5 parts of sodium hydroxide to adjust the pH value of soluti...

Embodiment 2

[0030] A. Add 1000 parts of formaldehyde into the reaction kettle, adjust the pH to 8.5 with 9 parts of sodium hydroxide, and add 2.5 parts of polyvinyl alcohol after 10 minutes to form solution A;

[0031] B. When the temperature rises to 30-35°C, add 368 parts of urea and 26.6 parts of melamine to solution A, raise the temperature to 88°C within 45 minutes, and keep the temperature at 88-92°C for 30 minutes to obtain solution B;

[0032] C. Slowly add 6.2 parts of formic acid to solution B, adjust the pH value to 6.3, and control the temperature at 88-92°C to react, when the viscosity reaches 21 seconds / 30°C as the end point, solution C is obtained;

[0033] D. Add 2.1 parts of triethanolamine to solution C, adjust the pH value to 7.2 with 5.8 parts of sodium hydroxide, add 191 parts of urea and 11.4 parts of melamine, and react at 83-85°C for 30 minutes to obtain solution D;

[0034] E. Add 7.0 parts of sodium hydroxide to adjust the pH value of solution D to 7.35, add...

Embodiment 3

[0037] A. Add 1000 parts of formaldehyde into the reaction kettle, adjust the pH to 8.7 with 9.8 parts of sodium hydroxide, and add 2.1 parts of polyvinyl alcohol after 10 minutes to form solution A;

[0038] B. When the temperature rises to 30-35°C, add 376 parts of urea and 28.7 parts of melamine to solution A, raise the temperature to 88-92°C within 30-60 minutes, and keep the temperature at 88-92°C for 30 minutes. Obtain solution B;

[0039] C. Slowly add 7.8 parts of formaldehyde to solution B, adjust the pH value to 5.8, and control the temperature at 88-90°C for reaction, when the viscosity reaches 20.3 seconds / 30°C as the end point, solution C is obtained;

[0040] D. Add 2.6 parts of triethanolamine to solution C, adjust the pH value to 7.4 with 5.7 parts of sodium hydroxide, add 190 parts of urea and 12.3 parts of melamine, and react at 80-85°C for 30 minutes to obtain solution D;

[0041] E. Add 7.3 parts of sodium hydroxide to adjust the pH value of solution ...

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Abstract

The invention discloses an adhesive with ultralow formaldehyde release amount and a preparation method of the adhesive, and relates to the technical field of adhesives for artificial boards. The adhesive comprises the following raw materials: 990 to 1,000 parts of formaldehyde, 810 to 840 parts of urea, 38 to 45 parts of melamine, 28 to 32 parts of sodium hydroxide, 6 to 8 parts of formic acid, 2 to 3 parts of triethanolamine and 1.5 to 2.5 parts of polyvinyl alcohol. According to inspection, the formaldehyde release amount of the adhesive provided by the invention is 2.0 to 3.0 mg/100 g (0.1 to 0.3 mg/L by a dryer method), and the adhesive strength and the transverse static bending strength accord with the national standard, so damage of artificial boards manufactured by the adhesive to a human body is close to zero, the indoor air quality is good and the preparation process is simple.

Description

technical field [0001] The invention relates to the technical field of adhesives for wood-based panels, in particular to an adhesive with ultra-low formaldehyde emission and a preparation method thereof. Background technique [0002] Adhesives and bonding technology have shown incomparable vigor and vitality, their importance is increasing day by day, their practicability is eye-catching, and their applications are becoming more and more extensive. At present, my country's adhesives mainly use formaldehyde as the main raw material for production, namely urea-formaldehyde resin glue, phenolic resin glue and melamine-formaldehyde resin glue, and its output accounts for more than 90% of the adhesives used in the entire wood-based panel industry. , Raw materials are easy to get, high bonding strength, color close to wood and many other advantages, and are favored by most wood-based panel companies, and its dosage accounts for more than 85% of the total amount of the above three a...

Claims

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Application Information

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IPC IPC(8): C09J161/30C09J129/04C08G12/38
Inventor 陆美莲陈仲炯
Owner GUANGXI SUNWAY FOREST PROD IND
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