A packaging structure and packaging method for radio frequency inductors

Abstract

The invention relates to a packaging structure of a radio frequency inductor and a packaging method thereof, belonging to the technical field of semiconductor packaging. The process: provide a metal carrier (T100); set a photoresist layer I (T210) on the metal carrier (T100), and use an electroplating process to form a metal line in the photoresist layer I opening pattern (T211) ( 100); using the same process, set metal posts (200) at the inner and outer ports of the inductance coil (110); remove the photoresist plastic-encapsulated metal wires (100) and metal posts (200); remove the metal carrier (T100), and place The exposed surfaces of the metal wire (100) and the metal post (200) are respectively coated with a metal coil protection layer (310) and a metal post protection layer (320); solder balls (500) are arranged on the metal post protection layer (320) to realize inductance connection to the carrier board. The radio frequency inductor of the present invention has no silicon or ceramics as a substrate, can reduce process difficulty and production cost, improve Q value, and reduce inductance size, so as to facilitate market promotion of portable devices.

Description

technical field [0001] The invention relates to a packaging structure of a radio frequency inductor and a packaging method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] Due to the continuous improvement of IC (integrated circuit) design and process technology, the scale of integrated circuits is getting larger, the complexity and integration are getting higher and higher, and the entire system, including analog circuit parts and digital circuit parts, can be integrated into one chip. . Since inductors are used in all important subunits of radio frequency integrated circuits, inductors occupy a large area of ​​radio frequency integrated circuits, and their performance directly affects the overall performance of radio frequency integrated circuits. Therefore, radio frequency inductors are used to achieve low An important component of low cost, low voltage, low power RFIC (Radio Frequency Integrated Circuit). [0003] At p...

AI Technical Summary

Problems solved by technology

[0003] At present, silicon-based inductors or low-temperature ceramic inductors realized by semiconductor rewiring technology in portable devices have the characteristics of good high-frequency performance, high precision, high stability, and large size, but their process difficulty and production cost are relatively high; The existence of eddy current loss in the inductor matrix at high frequencies affects the Q value; its size is also limited by the presence of substrates (such as silicon substrates, ceramic substrates) and further reduction, which is not conducive to the market promotion of portable devices

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