High frequency metal core circuit substrate production method

Abstract

The invention discloses a high frequency metal core circuit substrate production method. The method includes adopting tetrafluoroethylene powder and polyphenylene ether powder, performing ball-milling through a ball milling machine, then placing substrate dielectric material in a mole, forming a substrate dielectric material layer at high temperature in a pressed manner, selecting glass fiber cloth, placing in PTFE resin, preimpregnating through an impregnator, producing glass cloth impregnated bonding sheet by high-temperature sintering, finally selecting a copper foil layer, an insulation dielectric material layer, a glass cloth impregnated bonding sheet and a metal core, arranging the insulation dielectric material layer above the copper foil layer, inserting the glass cloth impregnated bonding sheet between the insulation dielectric material layer and the copper foil layer and bonding, arranging the metal core above the insulation dielectric material layer, inserting the glass cloth impregnated bonding sheet between the insulation dielectric material layer and the metal core and bonding, and finally forming in a pressed manner with pressure in the high-temperature environment. The high frequency metal core circuit substrate has the advantage of simple structure, reasonable design, good insulation, low thermal resistance, high thermal conductivity, good radiating performance, stable and reliable performance, and low producing cost.

Description

technical field [0001] The invention relates to a circuit board, in particular to a method for manufacturing a high-frequency metal-based circuit substrate. Background technique [0002] With the development of high-power, high-density electronic devices and the continuous advancement of electronic technology, electronic products are developing towards light, thin, small, and multi-functional. Traditional circuit substrates are gradually replaced by high-speed, high-reliability high-frequency circuits. substrate replacement. PTFE glass cloth copper clad board is favored by customers in high-frequency circuit substrates because of its low dielectric, low dielectric loss, low water absorption, and wide temperature range. It carries high-current, high-power high-frequency Metal-based circuit substrates have been widely used, and the problem of heat dissipation of electronic devices on circuit boards has become increasingly prominent. The bond between thicker copper foil and th...

AI Technical Summary

Problems solved by technology

PTFE glass cloth copper clad board is favored by customers in high-frequency circuit substrates because of its low dielectric, low dielectric loss, low water absorption, and wide temperature range. It carries high-current, high-power high-frequency Metal-based circuit substrates have been widely used, and the problem of heat dissipation of electronic devices on circuit boards has become increasingly prominent. The bond between thicker copper foil and the dielectric layer, the anti-peel strength is the key. The bonding force between the substrates and the peel strength after the formation of the circuit layer play a vital role. The peel strength index after thermal stress is not less than 1.05N / mm, which has always been a key index that plagues the production of this substrate. Tetrafluoroethylene glass cloth copper-clad laminate dielectric material polytetrafluoroethylene resin (PTFE) has a layer of irritated fluorine-containing shell outside the molecule, which has outstanding non-stick performance. After being applied in a high heat-resistant environment, the circuit board layer is easy to fall off. Or broken, causing the components on the circuit board to overheat, thus reducing the reliability of the whole machine