The invention discloses a
high frequency metal core circuit substrate production method. The method includes adopting
tetrafluoroethylene powder and polyphenylene
ether powder, performing ball-milling through a ball milling
machine, then placing substrate
dielectric material in a mole, forming a substrate
dielectric material layer at high temperature in a pressed manner, selecting
glass fiber cloth, placing in PTFE resin, preimpregnating through an impregnator, producing glass cloth impregnated bonding sheet by high-temperature
sintering, finally selecting a
copper foil layer, an insulation
dielectric material layer, a glass cloth impregnated bonding sheet and a
metal core, arranging the insulation dielectric material layer above the
copper foil layer, inserting the glass cloth impregnated bonding sheet between the insulation dielectric material layer and the
copper foil layer and bonding, arranging the
metal core above the insulation dielectric material layer, inserting the glass cloth impregnated bonding sheet between the insulation dielectric material layer and the metal core and bonding, and finally forming in a pressed manner with pressure in the high-temperature environment. The
high frequency metal core circuit substrate has the
advantage of simple structure, reasonable design, good insulation, low
thermal resistance, high
thermal conductivity, good radiating performance, stable and reliable performance, and low producing cost.