The invention discloses a high frequency metal core circuit substrate production method. The method includes adopting tetrafluoroethylene powder and polyphenylene ether powder, performing ball-milling through a ball milling machine, then placing substrate dielectric material in a mole, forming a substrate dielectric material layer at high temperature in a pressed manner, selecting glass fiber cloth, placing in PTFE resin, preimpregnating through an impregnator, producing glass cloth impregnated bonding sheet by high-temperature sintering, finally selecting a copper foil layer, an insulation dielectric material layer, a glass cloth impregnated bonding sheet and a metal core, arranging the insulation dielectric material layer above the copper foil layer, inserting the glass cloth impregnated bonding sheet between the insulation dielectric material layer and the copper foil layer and bonding, arranging the metal core above the insulation dielectric material layer, inserting the glass cloth impregnated bonding sheet between the insulation dielectric material layer and the metal core and bonding, and finally forming in a pressed manner with pressure in the high-temperature environment. The high frequency metal core circuit substrate has the advantage of simple structure, reasonable design, good insulation, low thermal resistance, high thermal conductivity, good radiating performance, stable and reliable performance, and low producing cost.