Texture etching solution compositions and texture etching methods for crystalline silicon wafers

Abstract

The present invention relates to texture etching solution compositions and texture etching methods for crystalline silicon wafers. The texture etching solution composition for crystalline silicon wafers comprises an alkaline compound; polysaccharide; fatty acid, metal salt of fatty acid or a mixture thereof in an optimum content together with polysaccharide to form uniformly on the surface of crystalline silicon wafer Texture with micro-cone structure to maximize solar energy absorption while reducing light reflection, thus improving luminous efficiency.

Description

technical field [0001] The invention relates to a texture etching composition and a texture etching method for a crystalline silicon wafer, which can uniformly form the surface of the crystalline silicon wafer to have a micro-cone structure, thereby improving luminous efficiency. Background technique [0002] In recent years, solar cells have grown rapidly and are called next-generation energy sources and electronic devices that directly convert clean energy (ie, solar energy) into electrical energy. This solar cell mainly has a P-type silicon semiconductor including silicon and boron added to silicon and includes a PN junction semiconductor substrate, wherein the P-type silicon semiconductor mainly has silicon and boron added to silicon, and the N-type silicon The semiconductor layer is formed by diffusing phosphorus (P) to the surface of a P-type silicon semiconductor. [0003] When light (such as sunlight) irradiates a substrate with an electric field generated through a...

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Problems solved by technology

However, since the above-mentioned etching solutions respectively include isopropyl alcohol having a relatively low boiling point and this substance must be additionally added during texturing, economical disadvantages are caused in terms of productivity and cost.

In addition, the additionally added isopropanol produces a temperature gradient of the etching solution, which increases the deviation of the texture quality over regions on the silicon wafer surface and ultimately degrades the homogeneity

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