Epoxy resin with shape memory property and preparation method thereof
A technology for epoxy resin and aliphatic epoxy resin, which is applied in the field of epoxy resin and its preparation, can solve the problems of difficult to achieve saturated shape memory effect, poor mechanical and thermal properties, difficult adjustment of thermal response temperature, etc. Good memory effect, good mechanical and thermal properties, and mature molding process
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[0041] The present invention also discloses a preparation method of the above-mentioned epoxy resin with shape memory, which includes the following steps: heating and melting the curing agent in the amount described above, and mixing it with the bisphenol A epoxy resin in the amount described at the same temperature , stir evenly, then add the amount of aliphatic epoxy resin, monohydric aliphatic amine and curing accelerator, then cure at 90~110°C for 2~4h, then raise the temperature to 140~155°C for 3~5h, and get Epoxy resin with shape memory.
[0042] Therefore, the thermal response temperature of the epoxy resin of the present invention can be adjusted conveniently, by changing the content of the monobasic aliphatic amine and the alkyl length or the content of epoxy resin in the formula, can easily adjust the influence temperature; The present invention adopts existing Polymers and composites are manufactured and processed, the molding process is mature, and the cost is low...
Embodiment 1
[0044] The epoxy resin with shape memory of the present embodiment comprises the following raw materials in parts by weight: 80 parts of bisphenol A type epoxy resin E-51, 20 parts of polyethylene glycol diglycidyl ether, 20.6 parts of monovalent n-alkane Amine, 14.4 parts of 1,6-hexanediamine, 0.1 part of dimethylimidazole.
[0045] The preparation method of the above-mentioned epoxy resin with shape memory includes the following steps: heating the amount of 1,6-hexanediamine to 102°C to melt, and mixing with the amount of bisphenol A at the same temperature Mix epoxy resin E-51, stir evenly, then add the amount of polyethylene glycol diglycidyl ether, monovalent n-alkane amine and dimethylimidazole, then cure at 90°C for 2 hours, then heat up to 140°C After curing for 3 hours, an epoxy resin with shape memory was obtained.
Embodiment 2
[0047] The epoxy resin with shape memory of the present embodiment includes the following raw materials in parts by weight: 67 parts of bisphenol A type epoxy resin E-44, 33 parts of polypropylene glycol diglycidyl ether, 35.5 parts of monovalent n-alkane amine, 20.3 parts of m-xylylenediamine, 2.2 parts of diisopropylimidazole.
[0048] The preparation method of the above-mentioned epoxy resin with shape memory comprises the following steps: heating the m-xylylenediamine of the amount to 105° C. for melting, and mixing with the bisphenol A type epoxy resin of the amount at the same temperature E-44 mixed, stirred evenly, and then added the amount of polypropylene glycol diglycidyl ether, monovalent n-alkane amine and diisopropylimidazole, then cured at 110°C for 4h, and then heated to 155°C for 5h to obtain Epoxy resin with shape memory.
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