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A kind of chemical method palladium-plated copper bonding wire and preparation method thereof

A bonding wire and electroless plating technology, which is applied in liquid chemical plating, semiconductor/solid-state device manufacturing, coating, etc., can solve the problems of high cost, cumbersome process, and large pollution in the packaging field, and achieve improved soldering performance, wire The performance of the wire material is good and the effect of meeting the requirements of the performance and quality of the wire material

Active Publication Date: 2016-03-30
北京达博有色金属焊料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, as the price of gold continues to rise, the cost of packaging has become higher and higher. At present, palladium-coated copper bonding wires have become more and more mature to replace gold wires. However, domestic palladium-coated copper wires can only be used in low-end packaging, while high-end Packaging is still monopolized by foreign palladium-plated copper wires. At present, most of the palladium plating methods in the world are electrochemical palladium plating, which is cumbersome, costly, and polluting.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0016] The preparation method of the present invention comprises the following steps:

[0017] (1) Casting and wire drawing: add 0.003%-0.04% phosphorus and 0.003%-0.01% manganese during the casting process, use intermediate frequency heating as the heating method, and use down-drawing vacuum continuous casting as the continuous casting method, and control the casting and wire drawing The conditions are: the melting temperature is 1100-1300°C, the vacuum degree is 1.0*10 -5 Mpa, the refining time is 20-40 minutes, the continuous casting speed is 150-300mm / min (ie mm / min), the diameter of the formed copper billet is 4-10mm (ie mm), and the wire drawing speed is 70-120m / min (ie m / min minute);

[0018] (2) Electroless palladium plating: put the finished copper bonding wire into the palladium plating solution for chemical palladium plating after annealing. The palladium ion concentration of the palladium plating solution is 5-20 grams per liter, and the palladium plating conditio...

Embodiment 1

[0023] (1) Casting and wire drawing: add 0.003% phosphorus and 0.003% manganese during the casting process, use intermediate frequency heating as the heating method, and use down-drawing vacuum continuous casting as the continuous casting method, and control the casting and wire drawing conditions as follows: the casting temperature is 1100°C, vacuum degree 1.0*10 -5 Mpa, the refining time is 20 minutes, the continuous casting speed is 150mm / min, the diameter of the formed copper billet is 4mm, and the wire drawing speed is 70m / min;

[0024] (2) Electroless palladium plating: put the finished copper bonding wire into the palladium plating solution for chemical palladium plating after annealing. For the palladium plating solution, the composition of the palladium plating solution is 6g / LPdCl, 10g / LNaH2PO2, 100ml / LNH4OH, 10g / LNH4Cl, the pH value of the palladium plating solution is controlled around 9.5, and the temperature of the palladium plating solution is controlled at 40 d...

Embodiment 3

[0029] (1) Casting and wire drawing: add 0.04% phosphorus and 0.01% manganese during the casting process, use intermediate frequency heating as the heating method, and use down-drawing vacuum continuous casting as the continuous casting method, and control the casting and wire drawing conditions as follows: the casting temperature is 1300°C, vacuum degree 1.0*10 -5 Mpa, the refining time is 40 minutes, the continuous casting speed is 300mm per minute, the diameter of the formed copper billet is 10mm, and the wire drawing speed is 120m / min;

[0030] (2) Electroless palladium plating: after annealing, put the finished copper bonding wire into the palladium plating solution for chemical palladium plating. / LNaH2PO2, 100ml / LNH4OH, 10g / LNH4Cl, the pH value of the palladium-plating solution is controlled around 9.5, and the temperature of the palladium-plating solution is controlled at 40 degrees Celsius; Neutral, more environmentally friendly. The post-plating palladium layer of ...

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Abstract

The invention discloses a chemical method palladium plating copper bonding wire and a preparing method thereof. The bonding wire comprises, by mass, 99.95% of copper, 0.003%-0.04% of phosphor, 0.003%-0.01% of manganese and the balance unavoidable impurities. Preparation of the bonding wire is finished through casting, wire drawing and chemical palladium plating, annealing, washing, compound winding and other steps before finished product annealing, and various parameters are reasonably used in the preparation process. The bonding wire and the preparing method thereof solve the problems of production and performance of a traditional palladium plating copper wire, the palladium plating copper bonding wire is safe, environmentally friendly and simple and saves energy in the production process, production efficiency of the wire is improved in the great degree, produced wires are good and stable in performance, and the requirements for wire performance and quality in the high-end packaging field can be met.

Description

technical field [0001] The invention relates to the field of metal bonding wires, in particular to a chemical method palladium-plated copper bonding wire and a preparation method thereof. Background technique [0002] In recent years, as the price of gold continues to rise, the cost of packaging has become higher and higher. At present, palladium-coated copper bonding wires have become more and more mature to replace gold wires. However, domestic palladium-coated copper wires can only be used in low-end packaging, while high-end Packaging is still monopolized by foreign palladium-plated copper wires. At present, most of the palladium plating methods in the world are electrochemical palladium plating, which is cumbersome, costly, and polluting. Contents of the invention [0003] The purpose of the present invention is to provide a preparation method for chemically palladium-coated copper bonding wires aimed at the problems existing in the prior art. The palladium-plated cop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01L21/48C22C9/00C23C18/42
CPCH01L24/43H01L24/45H01L2224/43H01L2224/4321H01L2224/43848H01L2224/45H01L2224/45144H01L2224/45147H01L2224/45565H01L2224/45664H01L2924/01015H01L2924/01025H01L2924/00H01L2924/20107H01L2924/20108H01L2924/20109H01L2924/2011H01L2924/20111H01L2924/013H01L2924/00014H01L2924/00012H01L2924/00015H01L2924/01203
Inventor 周晓光杜连民向翠华苏宏福陈彪
Owner 北京达博有色金属焊料有限责任公司