optical equipment

Abstract

The invention is directed to the provision of an optical device in which provisions are made to form a gap between an optical waveguide and a substrate without having to form a groove or the like in the substrate and to prevent any stress from being applied to an optical element even when it is heated by a heater for temperature adjustment. More specifically, the invention provides an optical device includes a substrate, an optical element with an optical waveguide formed in a surface thereof that faces the substrate, bonding portions formed on the substrate at positions that oppose each other across the optical waveguide, a heater, formed on at least one of the optical element and the substrate, for heating the optical waveguide, and a micro bump structure formed from a metallic material, wherein the optical element is bonded to the bonding portions via the micro bump structure in such a manner that a gap is formed between the optical waveguide and the substrate.

Description

technical field [0001] The present invention relates to an optical device in which an optical element forming an optical waveguide is bonded to a substrate. Background technique [0002] Short-wavelength laser light sources are widely commercialized in the fields of laser projectors and high-density optical storage. A short-wavelength laser light source outputs blue or green laser light through a wavelength conversion element that converts fundamental infrared light excited by a laser element of an optical device into a second harmonic wave. Although the wavelength conversion element uses LN (lithium niobate: LiNbO 3 ) and LT (lithium tantalate: LiTaO 3 ) and other crystal materials, but the conversion efficiency of high-order harmonics is temperature-dependent, and has the characteristic that the conversion efficiency varies greatly according to changes in the ambient temperature. [0003] FIG. 26( a ) is a graph showing an example of a change in the higher harmonic outp...

AI Technical Summary

Problems solved by technology

Also, since the thin film heat source 422 is not in contact with the silicon substrate 401 due to the groove 402 of the silicon substrate 401, the heat of the thin film heat source 422 is hardly transferred to the silicon substrate 401.

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