Low-temperature sintering microwave dielectric ceramic Bi12MgO19 and preparation method thereof

Abstract

The invention discloses low-temperature sintering microwave dielectric ceramic and a preparation method thereof. The composition of the low-temperature sintering microwave dielectric ceramic is Bi12MgO19. The preparation method comprises the following steps: (1) weighing original powder of Bi2O3 and MgO with the purities of above 99.9% according to the chemical formula Bi12MgO19; (2) carrying out wet-type ball milling on the raw materials in the step (1) and mixing for 12 hours, wherein a solvent is distilled water, drying, and then presintering for 6 hours at the 700 DEG C atmosphere; and (3) adding a binding agent to the powder prepared in the step (2), pelleting, carrying out compression molding, and finally sintering for 4 hours at the 750-780 DEG C atmosphere, wherein the binding agent is a polyvinyl alcohol solution with the mass concentration of 5%, and the dosage of the binding agent accounts for 3% of the total mass of the powder. The low-temperature sintering microwave dielectric ceramic prepared by the method has good sintering property at 750-780 DEG C, the dielectric constant of the ceramic reaches 13-14, the quality factor Qf of the ceramic reaches up to 66000-87000 GHz, the temperature coefficient of the resonance frequency of the ceramic is small, and therefore, the ceramic has enormous application value in industries.

Description

Technical field [0001] The invention relates to a dielectric ceramic material, in particular to a microwave dielectric ceramic material for microwave components such as dielectric substrates, resonators and filters used at microwave frequencies and a preparation method thereof. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials and perform one or more functions in circuits in the microwave frequency band (mainly UHF and SHF frequency bands). They are widely used as resonators, filters, and dielectric bases in modern communications. Chips and dielectric guided wave circuits are the key basic materials of modern communication technology. They have been used in portable mobile phones, car phones, cordless phones, TV satellite receivers and military radars. They are used in modern communication tools. The process of miniaturization and integration is playing an increasingly important role. [0003] The dielectric ceramic...

AI Technical Summary

Problems solved by technology

Therefore, the development of low-fired microwave dielectric ceramic materials without glass phase is the focus of current research. At present, the high-performance microwave dielectric ceramic system that can be sintered at low temperature is still very limited, which limits the development of low-temperature co-firing technology and microwave multilayer devices to a large extent. develop

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