Lead-free soldering tin wire

A technology of lead-free solder wire and lead-free solder, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of lead poisoning, achieve the effect of reducing lead poisoning, and is practical and convenient

Inactive Publication Date: 2014-02-19
NINGBO YINZHOU HENGXUN ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the toxicity of lead (Pb), when lead-containing waste is disposed of in landfills and acid rain dissolves the lead from the was...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example

[0022] Copper leaching speed

[0023] Each solder wire is heated to 400°C in a solder bath to reach a molten state. A coil of coated copper wire covered with an inner enamel coating and an outer polyurethane coating is dipped as the test material. After applying rosin flux to the coil end along a predetermined length, the coil end is dipped into molten solder wire at 400°C for 10 seconds, 20 seconds or 30 seconds. After each immersion period, the diameter of the copper wire was measured to determine the rate of decrease in wire diameter (in micrometers per second) caused by copper leaching as the copper leaching rate.

[0024] wettability

[0025] The wettability of each solder wire can be measured by dipping a copper sheet measuring 10 mm x 30 mm x 0.3 mm into the molten solder wire at 400 °C using a wetting weighing test. Wettability can be assessed by the zero crossing time (wetting time) for the wetting curve obtained during the test.

[0026] The lead-free Sn-Cu based...

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PUM

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Abstract

The invention discloses a lead-free soldering tin wire. The lead-free soldering tin wire is characterized by comprising, by mass, 1.5-8% of Cu, 0.01-2% of Co, 0.01-1% of Ni, and the balance Sn. The liquidus temperature of the lead-free soldering tin wire is 420 DEG C or below 420 DEG C. The lead-free soldering tin wire can further comprise one or more oxidation inhibition elements and/or one or more wetting improvement elements, and a composition of P, Ge and Ga or a composition with 0.05-2% of Ag by mass can be selected and used as the wettability improvement elements. The lead-free soldering tin wire coats the end portion of a copper wire coil. The lead-free soldering tin wire has the advantages that the lead-free soldering tin wire can not be subjected to copper leaching easily when being used in a molten state, the phenomenon of lead poisoning can be reduced, and the lead-free soldering tin wire is practical and convenient to use.

Description

Technical field [0001] The invention involves a welding wire, especially a lead -free welded wire. Background technique [0002] In electronic devices, various coils can be used in computers.Welding at the end of the coil is preferred to ensure a satisfactory welding joint after using the welding wire pre -coating end.This pre -coating can be immersed in the welded wire of the coil.Some copper wires used in electronic devices to make coils are thin to 100 microns or smaller in diameter.When the end of such a thin copper wire is immersed in the melting welding wire, the so -called copper may occur.Copper immersion is such a phenomenon, that is, the fine copper wires immersed in the melting welding wire are dissolved in the melting welded wire, which makes the wires thinner or completely disappear.Copper immersion may also occur during welding process at the end of the coil, especially in the welding process.In the past, countermeasures have been adopted to prevent copper in the fi...

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 王伟德
Owner NINGBO YINZHOU HENGXUN ELECTRONICS MATERIALS
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