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Method for printing copper conducting circuits in ink-jet mode

A conductive circuit and inkjet printing technology, which is applied in the field of circuit board manufacturing, can solve the problems of ink sedimentation blocking inkjet holes and high temperature required for sintering, and achieves the effects of low production cost, good dispersion and low viscosity

Inactive Publication Date: 2014-03-05
SHENZHEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for inkjet printing copper conductive circuit boards, to solve the problems in the prior art that the ink sinks to block the inkjet holes and the temperature required for sintering is too high

Method used

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  • Method for printing copper conducting circuits in ink-jet mode
  • Method for printing copper conducting circuits in ink-jet mode
  • Method for printing copper conducting circuits in ink-jet mode

Examples

Experimental program
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Embodiment 1

[0031] Step 1: Inkjet printing of nanosilver conductive ink. The viscosity is 1.8 centipoise, the solid content of metallic silver is 6g / 100ml, the average particle size of nano-metallic silver is about 50nm, the dispersant is polyvinylpyrrolidone (PVP) K88-96, the solvent is water and ethanol with a volume ratio of 1:0.5 The mixture, the nano-metallic silver conductive ink with a pH value of 8 is injected into the ink cartridge of the HP-D2600 (ink jet hole diameter 5 μm) ordinary inkjet printer, and the back-type test conductive circuit is printed on the polyimide film substrate. After the ink blots were dry, the printed ink blots were examined with an electron microscope, as shown in the attached figure 1 shown.

[0032] Step 2: Electroless copper plating to the printed ink. Preparation of electroless copper plating solution: weigh 15g CuSO 4 ·5H 2 O, 30g EDTA-2Na, 0.03g α-α' bipyridine, 0.08g potassium ferrocyanide, 20ml 37wt% HCHO aqueous solution, put it in a glass c...

Embodiment 2

[0035] Step 1: Inkjet printing of nanosilver conductive ink. The viscosity is 1.8 centipoise, the solid content of metallic silver is 1g / 100ml, the average particle size of nano-metallic silver is about 20nm, and the dispersant is a mixture of polyvinylpyrrolidone (PVP) K88-96 and OP-10 with a mass fraction of 3:5 , the solvent is a mixture of water and ethanol with a volume ratio of 1:1, and the nano-metallic silver conductive ink with a pH value of 8 is injected into the ink cartridge of the Fuji Dimatix type (ink jet hole diameter 1 μm) inkjet printer, on the polyimide film substrate Print back the font to test the conductive circuit. After the ink is dry, check the printed ink with an electron microscope.

[0036] Step 2: Electroless copper plating to the printed ink. Preparation of electroless copper plating solution: weigh 15g CuSO 4 ·5H 2O, 35g sodium citrate, 0.04g dihydroxynitrobenzene, 0.08g potassium ferrocyanide, 5ml hydrazine hydrate, put them in a glass contai...

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Abstract

The invention discloses a method for printing copper conducting circuits in an ink-jet mode. Nano-silver conductive ink which is low in solid content and viscosity is used as an activating agent which is printed to a base body in an ink-jet mode, electroless copper plating is carried out after ink marks are dried, and finally the copper conducting circuits are obtained. The nano-silver conductive ink used in the method is low in viscosity, small in grain diameter and good in dispersity, a common ink-jet printer can be used for printing the circuits, and ink jet holes are not blocked; the using amount of nano-silver grains is little, and production cost is low; high-temperature sintering of a circuit board manufactured through the method is not needed after ink-jet printing, temperature resistance of the printing stock base body is not required, and the application range of the nano-metal ink-jet printing technology is greatly expanded.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for inkjet printing copper conductive circuits. Background technique [0002] The Printed Electronics (Printed Electronics) technology of inkjet printing Printed Circuit Board (PCB) with nano metal conductive ink has brought a revolution to the modern electronics industry. This additive production process is not only simpler, environmentally friendly, and more efficient than the traditional photolithography subtractive process, but also enables dense wiring, making electronic products easier to miniaturize or thinner. It can realize the "what you see is what you get" flexible continuous production of circuit wiring diagrams from CAD design drawings to products, making PCB manufacturing as easy as printing documents in the office. [0003] Commonly used nano metal conductive inks are gold ink, silver ink and copper ink. Nano-gold or silver particles in gold in...

Claims

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Application Information

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IPC IPC(8): H05K3/12H05K3/18C23C18/40
Inventor 汤皎宁耿焕然朱光明龚晓钟
Owner SHENZHEN UNIV