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A kind of extinction type black polyimide resin and preparation method thereof

A polyimide resin, black polyimide technology, applied in the field of polymer materials, can solve problems such as complex methods, and achieve the effects of simple operation, good bonding strength and no pollution

Active Publication Date: 2016-04-06
西安航天三沃化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Patent Document 5: CN102529262A discloses a high-temperature-resistant coating type black matt polyimide, which uses a high-temperature-resistant acrylic black matt ink to coat the polyimide film base layer, and this method can maintain the polyimide film. The excellent characteristics of amine film can also maintain the high temperature resistance of acrylic black matt ink; but this method is more complicated, and it is necessary to prepare polyimide film and high temperature resistant acrylic black matt ink separately

Method used

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  • A kind of extinction type black polyimide resin and preparation method thereof
  • A kind of extinction type black polyimide resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1. Weigh 22.52g of direct suntan G and dissolve it in 159.39g of dimethylformamide, stir for 2 hours at a speed of 150min / r, and stand still for 4 hours. The upper layer solution is high-purity direct suntan G solution, high purity The content of the direct sun black G in the direct sun black G solution is 7.58%, and it is for use;

[0031] 2. Raise the temperature of the water bath to 36°C; add 295.09g of dimethylformamide into the flask, adjust the stirrer to 90min / r, add 36.24g of 4,4'-diaminodiphenyl ether into the flask, and stir until completely dissolved; slowly add 132.42g of the high-purity direct suntan G solution prepared in step 1 and 42.42g of pyromellitic dianhydride at the same time, the addition time is about 60min, and the reaction temperature of the materials is controlled at 40°C; stir evenly for 2h , to obtain a black polyamic acid solution;

[0032] 3. Laboratory coating, thermal imidization to form black polyimide film.

Embodiment 2

[0034] 1. Weigh 22.52g of direct diazonium black BH and dissolve it in 159.39g of dimethylacetamide, stir for 2 hours at a speed of 200min / r, and stand still for 4 hours. The upper solution is high-purity direct diazonium black BH solution, high-purity The content of direct diazo black BH in the direct diazo black BH solution is 7.58%, stand-by;

[0035] 2. Raise the temperature of the water bath to 36°C; add 295.09g of dimethylacetamide into the flask, adjust the stirrer to 90min / r, add 36.24g of aromatic diamide into the flask, and stir until completely dissolved; slowly and simultaneously Add 132.42g of the high-purity direct diazonium black BH solution prepared in step 1 and 42.42g of benzophenone dianhydride, the addition time is about 60min, and the reaction temperature of the materials is controlled at 40°C; uniformly stirred for 2h to obtain black polyamic acid solution.

[0036] 3. Conventional thermal imidization to form black polyimide film.

Embodiment 3

[0038] 1. Weigh 22.52g of C032 black base LS and dissolve it in 159.39g of dimethylformamide, stir for 2 hours at a speed of 180min / r, and stand still for 4 hours. The upper layer solution is high-purity C032 black base LS solution, high-purity C032 black base The content of C032 black base LS in LS solution is 7.58%;

[0039] 2. Raise the temperature of the water bath to 36°C; then add 295.09g of dimethylformamide into the flask, adjust the stirrer to 90min / r, add 36.24g of polyetherdiamine into the flask, and stir until completely dissolved; Slowly add 132.42g of the high-purity C032 black base LS solution prepared in step 1 and 42.42g of diphenyl ether dianhydride at the same time. The addition time is about 60 minutes, and the reaction temperature of the materials is controlled at 40°C; uniformly stirred for 2 hours to obtain black polyamide acid solution.

[0040] 3. Laboratory coating, thermal imidization to form black polyimide film.

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Abstract

The invention discloses a delustring type black polyimide resin and preparation method thereof, and belongs to the field of high-molecular material, and relates to application in the field of LED. The product is prepared by the following raw materials by weight ratio: 7.1-7.5 parts of dual anhydride, 8.5-8.6 parts of diamine, 1.8-1.9 parts of organic dyes and 82.6-82 parts of organic solvents. The invention has the beneficial effects that the invention method is simple, and compared to the traditional method, the method employs filling raw materials to influence mechanical performance of film, and the product has excellent heat resistance, chemical resistance and flexibility.

Description

technical field [0001] The invention relates to a matting black polyimide resin used in the field of LEDs, belonging to the field of polymer materials, in particular to a matting black polyimide resin and a preparation method thereof. Background technique [0002] Polyimide is a class of polymers containing imide rings (imide groups) on the main chain, among which polymers containing peptide imide rings are particularly important, which are composed of dibasic acids and dibasic amines The polyimide obtained by polycondensation contains a very stable aromatic heterocyclic structural unit in the molecule. As a special engineering material, it has high heat resistance, excellent mechanical properties and electrical properties unmatched by other polymer materials. At present, polyimide resins can be divided into two categories: thermosetting resins and thermoplastic resins. [0003] Tracing back the development history of polyimide, we can see that it is a promising polymer. A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10
Inventor 马建莉薛晓春程海标何小茜田江庞小东王莉娅燕莎谈珊珊臧鹏王志锋
Owner 西安航天三沃化学有限公司
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