Etching device adopting square light spot to etch double faced ITO glass

Abstract

The invention discloses an etching device adopting a square light spot to etch double faced ITO glass. A laser beam energy distribution mode can be converted from a Gaussian mode into an equipower distribution mode. A film at the irradiated portion can be evenly removed by shaped laser beams, namely the removed film thickness is consistent. The etching device comprises a support mechanism and equipower distribution shaping laser path mechanisms. The support mechanism comprises an upper support device and a lower support device which respectively comprise an equipower distribution shaping laser path mechanism used for providing equipower laser beams. In the Gaussian mode, energy distribution is large in middle and small in periphery in the use process of the laser beams, residues are retained on the machining edge of the double faced ITO glass in the etching process, and product machining problems are caused. The equipower laser beams can well solve the problems.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a laser etching processing device for ultraviolet laser etching double-sided ITO glass. [0002] Background technique [0003] ITO is the English abbreviation of indium tin oxide. It is a transparent conductor, usually only a few thousand angstroms thick. Among all transparent conductors, it has excellent physical properties: high visible light transmittance, high Infrared reflectivity, good mechanical strength and chemical stability, can easily form a certain electrode pattern with wet etching process such as acid solution, and the preparation is relatively easy, which makes it widely used in various electronic and optoelectronic devices, Such as flat panel display fields such as mobile phones and computers. Traditional double-sided ITO glass uses wet etching to make electrode patterns, which requires a lot of procedures, and the waste water generated after etching needs to be...

AI Technical Summary

Problems solved by technology

The etching device adopts equal-power distributed laser beams with uniform energy distribution to solve the problem of irregular, uniform and clean etching parts caused by Gaussian-mode distributed laser beams.

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