Manufacturing method for two-layer method produced double-side flexible copper-clad plate
A technology of flexible copper clad laminate and manufacturing method, applied in chemical instruments and methods, lamination, layered products, etc., can solve problems such as unfavorable production efficiency and complex process methods, and achieve the effect of improving production efficiency and simple process methods
Inactive Publication Date: 2014-03-26
SUZHOU CHENGBANG DALI MATERIAL TECH
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[0005] Because the current process method is complicated and not conducive to the improvement of production efficiency and production yield
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[0023] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0024] A method for manufacturing a two-layer double-sided flexible copper clad laminate, the specific steps are as follows:
[0025] Weigh a certain amount of diamine monomer ODA or DAPE and dissolve it in one or two reagents of polar solution dimethylformamide, dimethylacetamide, N-methylpyrrolidone or dimethyl sulfoxide, diamine The mass fraction of the monomer is 10%~15%, then stir at room temperature for 1-2 hours, divide the above solution into two parts on average, add different dianhydrides, one part is added with BPDA, and the other part is added with one of PMDA and BAPP or two kinds of reagents, the mass fraction of dianhydride in the solution is 15%, and stirring for 2-3 hours to obtain a thermosetting polyimide precursor solution and a thermoplastic polyimide precursor solution respectively.
[0026] Lay the copper foil on the coa...
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Abstract
The invention relates to the field of flexible printed circuit board manufacturing, in particular to a manufacturing method for a two-layer method produced double-side flexible copper-clad plate. The manufacturing method comprises the following steps: preparing a thermoplastic polyimide precursor solution and a thermoset polyimide precursor solution; laying copper foil on a coating machine, coating a two-formula three-layer polyamic acid structure on the copper foil at one time, and then performing high-temperature solidification to obtain a single-side plate, wherein in the three-layer structure, the middle sandwich layer is made of thermoset polyimide precursor solution, and the inner layer and the outer layer are made of thermoplastic polyimide precursor solution; allowing the copper foil and the single-side plate to be subjected to high temperature heat pressing and imidization processing to obtain the two-layer method produced double-side flexible copper-clad plate. According to the method, a three-cavity coating die head is adopted for coating the two-formula three-layer polyimide precursor solution at one time, then the solution is subjected to high-temperature solidification to obtain the single-side plate, and finally, the copper foil and the single-side plate are subjected to high temperature heat pressing and imidization processing, thereby obtaining the two-layer method produced double-side flexible copper-clad plate. Moreover, the process method is simple, and the production efficiency is improved.
Description
[0001] technical field [0002] The invention relates to the field of manufacturing flexible printed circuit boards, in particular to a method for manufacturing double-sided flexible copper-clad laminates by a two-layer method. [0003] Background technique [0004] In recent years, with the development of communication technology, personal electronic products have gradually become thinner. Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones and digital cameras. The permanent copper clad laminate is lighter and thinner and has high heat resistance and high reliability. [0005] Because the current process method is complicated and not conducive to the improvement of production efficiency and the improvement of production yield. Therefore, it is necessary to study a simple process method. [0006] Contents of the invention [0007] In order to overcome the above-mentioned defects, the purpo...
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IPC IPC(8): B32B37/00B32B37/06B32B15/08B32B27/28
Inventor 高小君张鹏董青山徐涛金晓龙唐春峰徐海燕
Owner SUZHOU CHENGBANG DALI MATERIAL TECH