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Preparation method for graphene-polyimide composite film

A technology of graphene polyimide and composite film, which is applied in the field of preparation of graphene polyimide composite film, can solve the problems of poor thermal conductivity and less research and development, and achieve good compatibility, stable structure, and improved thermal conductivity The effect of the dielectric constant

Active Publication Date: 2014-03-26
NINGBO JINSHAN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is very little research and development on graphene / polyimide composite materials, and the thermal conductivity of the materials currently developed is relatively poor, generally less than 0.5w / m.k, which cannot well meet the needs of the market

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] The preparation method of graphene polyimide composite film provided by the invention comprises adopting graphene and polyamic acid, and its concrete steps are as follows:

[0013] Step 1: First, 1 part of graphene is uniformly dispersed into 9 parts of dimethylacetamide solvent by grinding and dispersing, and then 1 part of polyamic acid is added to the above suspension, and the dispersion is continued, and finally a graphene suspension is obtained liquid;

[0014] Step 2: Dissolve 4,4-diaminodiphenyl ether and pyromellitic dianhydride in dimethylacetamide solvent at the same time, wherein 4,4-diaminodiphenyl ether and pyromellitic dianhydride are amine The number of moles of anhydride and the number of moles of anhydride are 1:0.80, and then the above-mentioned dispersed graphene suspension is added to the polyamic acid, and after circulating dispersion, it lasts for 10 hours to 16 hours, and then the polyamic acid is added The molar ratio of amine to anhydride is ad...

Embodiment 2

[0018] The concrete steps of the preparation method of graphene polyimide composite film in the present embodiment are as follows:

[0019] Step 1: First, 1 part of graphene is uniformly dispersed into 9 parts of dimethylacetamide solvent by grinding and dispersing, and then 1 part of polyamic acid is added to the above suspension, and the dispersion is continued, and finally a graphene suspension is obtained liquid;

[0020] Step 2: Dissolve 4,4-diaminodiphenyl ether and pyromellitic dianhydride in dimethylacetamide solvent at the same time, wherein 4,4-diaminodiphenyl ether and pyromellitic dianhydride are amine The number of moles of anhydride and the number of moles of anhydride are 1:0.90, and then the above-mentioned dispersed graphene suspension is added to the polyamic acid, and after circulating dispersion, it lasts for 10 hours to 16 hours, and then the polyamic acid is added The molar ratio of amine to anhydride is adjusted to 1:0.99, the viscosity reaches 90000 CP...

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Abstract

The invention discloses a preparation method for a graphene-polyimide composite film. The preparation method comprises the following steps: adopting graphene and polyamide acid prepared through enabling 4, 4-diaminodiphenyl ether and pyromellitic acid dianhydride to be subjected to polycondensation in a solvent; adding dispersed graphene suspension liquid into the polyamide acid prepared through polycondensation reaction, dispersing circularly for 10-16 hours, adjusting the molar ratio of amine to anhydride in the polyamide acid to (1:0.98)-(1:0.995), and enabling the viscosity to reach 60000 CP-90000 CP, wherein the graphene is 1-15% of the solid content of the polyamide acid; then, defoaming and casting for forming the film; finally, performing imidization, rolling and slitting. According to the graphene-polyimide composite film prepared by the preparation method, the tensile strength is not less than 100 Mpa, the heat-conducting property is not less than 5w / m.k, and the elongation at break is not less than 15%.

Description

technical field [0001] The invention relates to a preparation method of a graphene-polyimide composite film. Background technique [0002] Since the polyimide film (PI film) was put into use in the 1960s, its excellent thermal properties, dielectric properties and mechanical properties have made it the preferred material in the electronics and aerospace industries. With the development of high-tech, ordinary polyimide materials can no longer meet the requirements of high-tech products for material performance, so polyimide modification has become a research hotspot. Introducing inorganic components into the polyimide matrix to achieve the composite of inorganic-organic properties has become a more effective method in its modification work. [0003] Existing studies have shown that adding only a small amount of graphene can greatly improve the thermal conductivity and linear expansion coefficient of the resin matrix, greatly strengthening and broadening its application field...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08G73/10C08K3/04C08J5/18
CPCC08G73/1007C08G73/105C08J5/18C08J2379/08C08K3/04C08K2201/001C08K2201/003C08L2203/16C08L79/08
Inventor 岑建军
Owner NINGBO JINSHAN NEW MATERIAL
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