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Lead-free tinned zinc alloy copper clad steel wire

A technology of alloy copper-clad steel wire and lead-free tin-zinc plating, which can be used in metal/alloy conductors, circuits, electrical solid devices, etc., can solve the problem of high cost, achieve low cost, ensure electrical conductivity and corrosion resistance, good The effect of solderability

Inactive Publication Date: 2014-03-26
张家港市星河电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The technical difficulty of component leads using mainstream lead-free technology is basically the same as that of the original lead-based technology, and the main disadvantage is that the cost is higher

Method used

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  • Lead-free tinned zinc alloy copper clad steel wire

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Embodiment Construction

[0011] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0012] see figure 1 , the embodiment of the present invention includes:

[0013] A lead-free tin-zinc alloy copper-clad steel wire, comprising a steel core 1, a copper layer 2, and a tin-zinc alloy layer 3, the copper layer 2 is coated on the steel core 1 by electroplating, and the tin-zinc alloy layer 3 Electroplating is coated on the copper layer 2, the diameter of the lead-free tin-zinc alloy copper-clad steel wire is 0.5-0.7mm, and the thickness of the copper layer 2 is not less than the lead-free tin-zinc alloy copper 6% of the steel wire diameter, the material of the steel core 1 is mild steel; the material of the copper layer 2 is red cop...

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Abstract

The invention discloses a lead-free tinned zinc alloy copper clad steel wire comprising a steel core, a copper layer and a tin-zinc alloy layer. The copper layer is clad on the steel core in an electroplating way. The tin-zinc alloy layer is clad on the copper layer in the electroplating way. Diameter of the lead-free tinned zinc alloy copper clad steel wire is 0.5-0.7mm. Thickness of the copper layer is not less than 6% of the diameter of the lead-free tinned zinc alloy copper clad steel wire. Material of the steel core is soft steel. The material of the copper layer is red copper. The material of the tin-zinc alloy layer is Sn-8Zn-5In-0.1Ag alloy. With application of the aforementioned method, the plating layer uses the lead-free Sn-8Zn-5In-0.1Ag alloy so that the lead-free tinned zinc alloy copper clad steel wire is low in cost, great in weldability, conductivity and corrosion resistance and safe and environment-friendly.

Description

technical field [0001] The invention relates to the field of lead wires of electronic components, in particular to a lead-free tin-zinc alloy copper-clad steel wire. Background technique [0002] In the traditional process, most tinned copper-clad steel wires use electroplating or immersion tin to form a surface coating with Sn-Pb solder as the main body on the outside of the copper-clad steel wire. Since the coating contains lead, it is extremely harmful to the human body and will cause Nervous system and reproductive system disorders, nervous and physical developmental delays will cause toxic nephropathy to the kidneys, hemoglobin disorders, and finally lead to anemia. Lead poisoning is especially harmful to the neurodevelopment of young children. [0003] After years of development, the lead-free technology of lead soldering end plating of electronic components has become a relatively mature technology. Many component suppliers in Japan, Europe and the United States, suc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01B1/02C22C13/00
CPCH01L24/43H01L2224/45611H01L2224/45647H01L2224/45572H01L2224/4516H01L24/45H01L2224/45015H01L2924/01322H01L2224/43H01L2224/45H01L2924/0103H01L2924/0105H01L2924/01049H01L2924/01047H01L2924/00H01L2924/00014H01L2924/013H01L2924/00012
Inventor 闵雁
Owner 张家港市星河电子有限公司