Measuring method of deep-hole copper plating accelerant

Abstract

The invention relates to a measuring method of a deep-hole copper plating accelerant. The measuring method comprises the following steps: (1) forming a three-electrode system by a metal electrode, an inert metal sheet and a saturated calomel electrode which are taken as a working electrode, a counter electrode and a reference electrode respectively, and selecting a copper electroplating solution; (2) measuring a cathodic polarization curve of an accelerant-free basic electroplating solution; (3) adding accelerants of different concentration into the basic electroplating solution, and respectively measuring corresponding cathodic polarization curves; (4) comparing the cathodic polarization curve of the step (2) with the cathodic polarization curves of the step (3), and analyzing relevant parameters of the curves so as to acquire a quantitative relation curve between relevant electrochemical parameters and the concentration of the accelerants; and (5) measuring an actual to-be-measured copper plating solution by the same electrode system so as to obtain a result. By taking the cathodic polarization curves as measuring objects, the measuring method is close to an actual electroplating process, so that the management and process quality control of the copper electroplating solution are directed, and the industrial application of a TSV copper electroplating process is promoted.

Description

technical field [0001] The invention belongs to the fields of semiconductor manufacturing, thin film material manufacturing and electrochemical technology application, and in particular relates to a method for measuring a deep hole copper plating accelerator. Background technique [0002] At present, deep-hole copper plating technologies for chip Damascus copper interconnection, wiring in PCB boards, and through-silicon-hole vertical copper interconnections are more and more widely used in the field of microelectronics manufacturing, and the complete filling technology of these deep-hole copper plating It largely depends on the function of additives. At present, according to the different functions of additives, it can be roughly divided into three types: accelerators, inhibitors and leveling agents. Accelerators and inhibitors play a major role in the process. Since most of the additives that play a key role in the plating solution are organic surfactants, their concentrat...

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Problems solved by technology

However, since this method is based on the determination of the total amount of copper dissolved in the anode process, this analysis method cannot evaluate the cathode process that affects the filling effect, judge the role and effect of additives in electrodeposition, and select process parameters. With optimization, the assessment of bath lifetime appears powerless

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