Leading-out process for anode and cathode of end cap-type tantalum capacitor

Abstract

The invention discloses a leading-out process for an anode and a cathode of an end cap-type tantalum capacitor. The leading-out process comprises the following steps: (1) getting a tantalum core preform with the anode and the cathode; (2) enabling a high-temperature adhesive tape of which the width is equal to that of the tantalum core preform to cling to the bottom part of a tantalum core, and then, preheating the tantalum core; (3) burying the preheated tantalum core in epoxy resin powder for 2s-5s, and then, tearing off the high-temperature adhesive tape at the bottom part of the tantalum core; (4) solidifying epoxy resin; (5) solidifying cathode silver paste; (6) solidifying anode silver paste; (7) separating the tantalum core to become a whole individual with specified dimensions; (8) electroplating the tantalum core obtained in the step (7). The leading-out process disclosed by the invention has the beneficial effects that an anode and cathode leading-out process for a traditional tantalum capacitor is improved; without an anode and cathode soldering lug or a leading-out wire, the middle part of the tantalum capacitor is insulated by utilizing the epoxy resin; the anode and the cathode of the capacitor are directly led out by the silver paste at both ends, so that the design space of the tantalum capacitor is enlarged.

Description

technical field [0001] The invention relates to a process for leading out positive and negative poles of an end-cap type tantalum capacitor, belonging to the technical field of solid electrolyte tantalum capacitors. Background technique [0002] Tantalum capacitors have many excellent properties such as small size, large capacitance, small leakage current, long life, and good storage stability, and are widely used in various military applications such as aerospace, aerospace, aviation, weapons, ships, communications, instrumentation, etc. In the field of civilian electronics. In recent years, with the continuous development of technology in the microelectronics industry, the volume required for electronic complete machines has become smaller and smaller. At present, tantalum capacitors are developing in the direction of small size and high reliability. [0003] In the existing manufacturing process of molded tantalum capacitors, such as figure 1 As shown, the positive and...

AI Technical Summary

Problems solved by technology

[0003] In the existing manufacturing process of molded tantalum capacitors, such as figure 1 As shown, the positive and negative poles are drawn out by soldering tabs or lead-out wires, and the ends of the positive and negative poles are filled with thick molding materials, which greatly wastes the space for the anode design of tantalum capacitors and fails to improve the performance of tantalum capacitors. to the limit

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