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A leading-out process for the positive and negative poles of an end-cap tantalum capacitor

A technology of tantalum capacitors, positive and negative poles, which is applied in the lead-out process of the positive and negative poles of end-cap tantalum capacitors, can solve the problems of wasting anode space of tantalum capacitors, and achieve the effect of increasing the design space

Active Publication Date: 2016-08-24
CHINA ZHENHUA GRP XINYUN ELECTRONICS COMP ANDDEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing manufacturing process of molded tantalum capacitors, such as figure 1 As shown, the positive and negative poles are drawn out by soldering tabs or lead-out wires, and the ends of the positive and negative poles are filled with thick molding materials, which greatly wastes the space for the anode design of tantalum capacitors and fails to improve the performance of tantalum capacitors. to the limit

Method used

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  • A leading-out process for the positive and negative poles of an end-cap tantalum capacitor
  • A leading-out process for the positive and negative poles of an end-cap tantalum capacitor

Examples

Experimental program
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Effect test

Embodiment 1

[0025] Taking the end-cap tantalum capacitor 25V47μF as an example, a leading-out process for the positive and negative electrodes of the end-cap tantalum capacitor includes the following steps:

[0026] (1) According to the existing process steps, molding, sintering, spot welding, forming, coating, and graphite silver paste are completed to obtain the prototype of the tantalum core with positive and negative electrodes;

[0027] (2) Attach the high-temperature tape with the same width as the prototype of the tantalum core to the bottom of the tantalum core, and then preheat the tantalum core to make the temperature reach 160°C;

[0028] (3) Embed the preheated tantalum core in epoxy resin powder for 2 seconds, and then tear off the high-temperature tape on the bottom of the tantalum core;

[0029] (4) Put the tantalum core with epoxy resin powder on the surface into an oven at 120°C for 120 minutes to cure the epoxy resin;

[0030] (5) Immerse 1 / 4 of the lower part of the ta...

Embodiment 2

[0035] Taking the end-cap tantalum capacitor 6.3V330μF as an example, a leading-out process for the positive and negative electrodes of the end-cap tantalum capacitor includes the following steps:

[0036] (1) According to the existing process steps, molding, sintering, spot welding, forming, coating, and graphite silver paste are completed to obtain the prototype of the tantalum core with positive and negative electrodes;

[0037] (2) Attach the high-temperature tape with the same width as the prototype of the tantalum core to the bottom of the tantalum core, and then preheat the tantalum core to make the temperature reach 120°C;

[0038] (3) Embed the preheated tantalum core in epoxy resin powder for 4 seconds, and then tear off the high-temperature tape on the bottom of the tantalum core;

[0039] (4) Put the tantalum core with epoxy resin powder on the surface into an oven at 90°C for 150 minutes to cure the epoxy resin;

[0040] (5) Immerse the lower part of 1 / 3 of the t...

Embodiment 3

[0045] A process for drawing out the positive and negative poles of an end-cap type tantalum capacitor comprises the following steps:

[0046] (1) According to the existing process steps, molding, sintering, spot welding, forming, coating, and graphite silver paste are completed to obtain the prototype of the tantalum core with positive and negative electrodes;

[0047] (2) Attach the high-temperature tape with the same width as the prototype of the tantalum core to the bottom of the tantalum core, and then preheat the tantalum core to make the temperature reach 200°C;

[0048] (3) Embed the preheated tantalum core in epoxy resin powder for 3 seconds, and then tear off the high-temperature tape on the bottom of the tantalum core;

[0049] (4) Put the tantalum core with epoxy resin powder on the surface into an oven at 150°C for 60 minutes to cure the epoxy resin;

[0050] (5) Immerse 1 / 5 of the lower part of the tantalum core obtained in step (4) with silver paste, and put it...

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Abstract

The invention discloses a leading-out process for an anode and a cathode of an end cap-type tantalum capacitor. The leading-out process comprises the following steps: (1) getting a tantalum core preform with the anode and the cathode; (2) enabling a high-temperature adhesive tape of which the width is equal to that of the tantalum core preform to cling to the bottom part of a tantalum core, and then, preheating the tantalum core; (3) burying the preheated tantalum core in epoxy resin powder for 2s-5s, and then, tearing off the high-temperature adhesive tape at the bottom part of the tantalum core; (4) solidifying epoxy resin; (5) solidifying cathode silver paste; (6) solidifying anode silver paste; (7) separating the tantalum core to become a whole individual with specified dimensions; (8) electroplating the tantalum core obtained in the step (7). The leading-out process disclosed by the invention has the beneficial effects that an anode and cathode leading-out process for a traditional tantalum capacitor is improved; without an anode and cathode soldering lug or a leading-out wire, the middle part of the tantalum capacitor is insulated by utilizing the epoxy resin; the anode and the cathode of the capacitor are directly led out by the silver paste at both ends, so that the design space of the tantalum capacitor is enlarged.

Description

technical field [0001] The invention relates to a process for leading out positive and negative poles of an end-cap type tantalum capacitor, belonging to the technical field of solid electrolyte tantalum capacitors. Background technique [0002] Tantalum capacitors have many excellent properties such as small size, large capacitance, small leakage current, long life, and good storage stability, and are widely used in various military applications such as aerospace, aerospace, aviation, weapons, ships, communications, instrumentation, etc. In the field of civilian electronics. In recent years, with the continuous development of technology in the microelectronics industry, the volume required for electronic complete machines has become smaller and smaller. At present, tantalum capacitors are developing in the direction of small size and high reliability. [0003] In the existing manufacturing process of molded tantalum capacitors, such as figure 1 As shown, the positive and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/012H01G9/14H01G9/08
Inventor 曹俭兵王安玖赵泽英彭丹吴娅
Owner CHINA ZHENHUA GRP XINYUN ELECTRONICS COMP ANDDEV CO LTD
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