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Colored metal-based printed board and manufacturing method thereof

A metal substrate, color metal technology, applied in the direction of printed circuit manufacturing, circuit substrate materials, printed circuits, etc., can solve problems such as thermal sensitivity and poor photosensitivity effect, and achieve the effect of increasing visual effects

Inactive Publication Date: 2014-04-02
邢台市海纳电子科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One of the purposes of the present invention is to provide a colored metal-based printed board to solve the problems of poor thermal and photosensitive effects existing in existing metal-based circuit boards

Method used

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  • Colored metal-based printed board and manufacturing method thereof
  • Colored metal-based printed board and manufacturing method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Such as figure 1 As shown, the thickness of the metal substrate 1 is 0.3-5mm. Firstly, the metal substrate 1 is subjected to anodic oxidation treatment and surface coloring treatment, and an insulating chemical conversion film 2 is formed on the surface of the metal substrate 1, and then hot-pressed on the surface of the metal substrate 1 in sequence. After bonding the insulating dielectric layer 3 and the copper foil layer 4, the metal-based copper clad laminate is formed. After the surface of the copper foil layer 4 of the metal-based copper-clad laminate is subjected to operations such as pasting film, transferring circuit patterns, etching, and film removal, the colored metal-based printed board of the present invention is formed.

[0047] The surface coloring treatment of metal substrate 1 can adopt CuSO 4 Electrolytic coloring is carried out as an electrolytic solution, or electrostatic spraying is used for spraying coloring, or organic dyes are used for adsorpti...

Embodiment 2

[0049] The manufacturing method of the colored metal-based printed board of the present invention comprises the following steps:

[0050] 1. Carry out anodic oxidation and surface coloring treatment on the metal substrate with a thickness of 0.3-5mm, and then pass it in a concentrated sulfuric acid solution with a concentration of 22g / l at 1-1.5A / dm 2 Under the intensity of direct current, immerse the metal substrate for 10-15 minutes, and then immerse it in a saturated potassium dichromate solution at a temperature of 95-100°C for 5-20 minutes to generate insulation on the surface of the metal substrate. chemical conversion coating. The anodic oxidation and surface coloring treatment of the metal substrate is mainly through chemical and electrochemical treatment of the surface of the metal substrate to make it have a certain roughness, and to form a high-insulation chemical conversion film with a certain thickness on the surface , so that the resin film layer has high resist...

Embodiment 3

[0080] The manufacturing method of the colored metal-based printed board of this embodiment is basically the same as that of Embodiment 2, except that the surface coloring process of the metal substrate is sprayed and colored by electrostatic spraying, and the specific process is:

[0081] ① Degreasing: Put the metal substrate in H 2 SO 2 Soak in water for 3 to 5 minutes to degrease.

[0082] ② Alkaline cleaning: Soak the degreased metal substrate in a sodium hydroxide solution with a mass concentration of 45-85 g / L for 5-15 minutes, and perform alkaline cleaning.

[0083] ③ Illumination: Immerse the metal substrate after alkali cleaning into H2O with a concentration of 200-250g / L 2 SO 2 with H at a concentration of 3-5 g / L 2 NO 3 in the mixed solution for 3-5 minutes to neutralize the alkaline metal salts on the surface of the metal substrate and clean the surface of the metal substrate.

[0084] ④ Anodizing: Put the surface-treated metal substrate in concentrated sulfu...

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Abstract

The invention relates to a colored metal-based printed board and a manufacturing method thereof. The method comprises the steps that an insulated chemical conversion film is attached to the surface of a metal basal plate subjected to the anode oxidation and surface coloring processing, and a metal-based copper-clad plate is formed by adhering an insulation medium layer and a copper foil layer onto the surface of the metal basal plate in a hot-press mode; the colored metal-based printed board is formed after the surface of the copper foil layer of the metal-based copper-clad plate is subjected to film pasting, line pattern transferring, etching and film removing. The colored metal-based printed board reserves all advantages of a common metal-based printed board and is added with different colors of the plate surface compared with the common metal-based plate; as the colors are different, the colored metal-based printed board has different energy inductions for light and heat and meets the use demands in the special printed fields such as aviation and military. The visual effect of the whole equipment appearance is increased and attractive and elegant effects are achieved.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a colored metal-based printed board and a manufacturing method thereof. Background technique [0002] Printed circuit boards have been developed to the present, and can be divided into ordinary circuit boards and metal-based circuit boards according to the classification of substrates. In industrial production practice, the application of metal-based circuit boards is also relatively common. However, in specific applications, in aerospace and other fields, higher requirements are put forward for components in terms of thermal sensitivity and light sensitivity. The existing common metal-based circuit boards can no longer meet the requirements of devices in terms of thermal and photosensitive effects. Contents of the invention [0003] One of the objectives of the present invention is to provide a colored metal-based printed board to solve the problems of poor thermal and photosensiti...

Claims

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Application Information

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IPC IPC(8): H05K1/05H05K3/00C25D11/02C25D3/38
Inventor 张伯平
Owner 邢台市海纳电子科技有限责任公司
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