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Preparation method of wide multi-layer cu-cumo70-cu composite material

A cu-cumo70-cu and composite material technology is applied in the field of preparation of wide-width multi-layer Cu-CuMo70-Cu composite materials, which can solve cracking, cannot prepare wide-width and large-size multi-layer Cu-Mo-Cu composite materials, deformation and other problems, to achieve the effect of high bonding strength

Active Publication Date: 2016-08-24
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing a wide-width multi-layer Cu-CuMo70-Cu composite material, which solves the defects such as cracking and deformation that often occur in the rolling process of the existing Cu-Mo-Cu thin plate, resulting in the inability to prepare wide Problems of Large Size Multilayer Cu-Mo-Cu Composites

Method used

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  • Preparation method of wide multi-layer cu-cumo70-cu composite material

Examples

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Effect test

Embodiment 1

[0029] In order to prepare a 3-layer Cu-CuMo70-Cu composite material, a mold with 3 layers of heterogeneous materials was designed, a CuMo70 plate with a size of 100mm×100mm×3mm was machined, and a T2 pure Cu material with a size of Φ48mm×198mm was prepared ;

[0030] Wash the residual scale on the surface of the Cu material with gasoline, and then use alcohol to clean the oil stains remaining on the surface of the Cu material; perform electrolytic corrosion of 75% phosphoric acid on the surface of the CuMo70 plate for 1 min;

[0031] Put the CuMo70 plate in the middle layer of the 3-layer heterogeneous material forming mold, put the surface-treated Cu material into the graphite crucible, and add 10 grams of CuNi10 material to it, place the graphite crucible on the mold and put it into the ZRS- In the 18Q microcomputer program-controlled vacuum high-temperature sintering furnace, vacuum the ZRS-18Q microcomputer program-controlled vacuum high-temperature sintering furnace. Whe...

Embodiment 2

[0034] In order to prepare 7-layer Cu-CuMo70-Cu composites, the design as figure 2 The mold 2 shown has 7 layers of heterogeneous material molding, machining 3 CuMo70 plates with a size of 100mm×100mm×1mm, and preparing a T2 pure Cu material with a size of Φ48mm×172mm;

[0035] Wash the residual scale on the surface of the Cu material with gasoline, and then use alcohol to clean the oil stains remaining on the surface of the Cu material; perform electrolytic corrosion of 75% phosphoric acid on the surface of the CuMo70 plate for 2 minutes;

[0036]Put the pretreated CuMo70 plate 1 on the even-numbered layer in the 7-layer heterogeneous material forming mold 2, put the Cu material for surface treatment into the graphite crucible, and add 30 grams of CuNi10 material therein, and place the graphite crucible on the mold Put it into the ZRS-18Q microcomputer program-controlled vacuum high-temperature sintering furnace, and vacuum the ZRS-18Q microcomputer program-controlled vacuum...

Embodiment 3

[0039] In order to prepare a 13-layer Cu-CuMo70-Cu composite material, a mold with 13 layers of heterogeneous materials was designed, 6 CuMo70 plates with a size of 100mm×100mm×0.8mm were machined, and T2 pure Cu with a size of Φ48mm×132mm was prepared Material;

[0040] Rinse the residual scale on the surface of the Cu material with gasoline, and then use alcohol to clean the oil stains remaining on the surface of the Cu material; perform electrolytic corrosion of 75% phosphoric acid on the surface of the CuMo70 plate for 3 minutes;

[0041] Put the pre-treated CuMo70 sheet on the even-numbered layer in the 13-layer heterogeneous material forming mold, put the surface-treated Cu material into the graphite crucible, and add 60 grams of CuNi10 material into it, put the graphite crucible on the mold and put it into ZRS -18Q microcomputer program-controlled vacuum high-temperature sintering furnace, vacuumize the ZRS-18Q microcomputer program-controlled vacuum high-temperature si...

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Abstract

The preparation method of wide multi-layer Cu-CuMo70-Cu composite material, put the pretreated CuMo70 plate in the mold, then place the CuNi10 material and the surface-treated Cu material together in a graphite crucible, and place the graphite crucible in Put it on the mold and put it together in a vacuum sintering furnace for infiltration and sintering, then keep it warm, and finally remove the excess Cu, and roll it in multiple passes at 650-900°C. The preparation method of the present invention utilizes the difference in expansion coefficient and melting point between metal Cu and CuMo70 alloy, adds an appropriate amount of third component CuNi10 material between Cu and CuMo70 to realize the high-strength metallurgical combination of the two, and undergoes vacuum high-temperature sintering and slow cooling , the formed bimetallic composite material not only has the respective performance advantages of metal Cu and CuMo70 alloy, but also has high bonding strength, and its interface bonding strength can reach more than 200Mpa.

Description

technical field [0001] The invention belongs to the technical field of composite material preparation and relates to a preparation method of a wide-width multilayer Cu-CuMo70-Cu composite material. Background technique [0002] Copper (Cu) has high electrical and thermal conductivity. Copper-molybdenum alloy (CuMo70) has the advantages of low thermal expansion coefficient, high strength, and low remanence. If two heterogeneous materials, Cu and CuMo70, are connected by special material molding Together, a multilayer Cu-CuMo70-Cu heterogeneous composite material with excellent comprehensive properties will be prepared, which will synergistically exert the respective performance advantages of these two materials and realize the integration of structure and function. It can be used as a heat sink or electronic packaging The material is widely used and has broad application prospects in microelectronics and other fields. [0003] At present, due to the good ductility of copper,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F7/04C22F1/08
Inventor 邹军涛李阳杨鑫杨晓红梁淑华
Owner XIAN UNIV OF TECH
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