Negative-type photosensitive resin composition, resin film, and electronic component

A technology of photosensitive resin and composition, applied in optics, optomechanical equipment, photosensitive materials used in optomechanical equipment, etc., can solve the problem of insufficient pattern formation, development and adhesion, and achieve excellent pattern formation , Excellent solubility effect

Inactive Publication Date: 2014-04-09
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the photosensitive resin composition described in Patent Document 1, the pattern formation properties during development, especially the development adhesiveness (the density of the developed pattern when the width of the developed pattern is thinned and made high-definition) compatibility) is not necessarily sufficient, and therefore, improvement in pattern formation in development is expected

Method used

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  • Negative-type photosensitive resin composition, resin film, and electronic component
  • Negative-type photosensitive resin composition, resin film, and electronic component

Examples

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preparation example Construction

[0123] The preparation method of the negative photosensitive resin composition of this invention is not specifically limited, What is necessary is just to mix each component which comprises a negative photosensitive resin composition by a well-known method.

[0124]The method of mixing is not particularly limited, but it is preferable to mix a solution or a dispersion obtained by dissolving or dispersing each component constituting the negative photosensitive resin composition in a solvent. Thereby, a negative photosensitive resin composition is obtained in the form of a solution or a dispersion liquid.

[0125] The method of dissolving or dispersing each component which comprises a negative photosensitive resin composition in a solvent may follow a conventional method. Specifically, stirring with a stirrer and a magnetic stirrer, a high-speed homogenizer, a disperser, a planetary mixer, a twin-screw mixer, a ball mill, a three-roll machine, and the like can be used. In addit...

Embodiment 1

[0183] Add polyether-modified silicone oil (trade name "KP341", manufactured by Shin-Etsu Silicone Co., Ltd.) 300ppm to the following ingredients and mix and stir to dissolve them. The ingredients include:

[0184] Carboxyl group-containing resin compound (A1): 70 parts of carboxylic anhydride-modified cresol novolac epoxy acrylate (trade name "NK Oligo EA-7140", manufactured by Shin-Nakamura Chemical Co., Ltd., weight average molecular weight: 1700) was dissolved in propylene glycol mono 100 parts of the solution obtained by 30 parts of methyl ether acetate;

[0185] Carboxyl-free resin compound (A2): 20 parts of a mixture of urethane acrylate and polyoxypropylene monoacrylate (trade name "NK Oligo UA-4200", manufactured by Shin-Nakamura Chemical Co., Ltd.);

[0186] (Meth)acryloyl compound (B): 50 parts of a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (trade name "Aronix M402", manufactured by Toagosei Co., Ltd., weight average molecular wei...

Embodiment 2

[0195]The compounding quantity of the polyethylene glycol diglycidyl ether which is an epoxy group-containing crosslinking agent (E) was changed from 100 parts to 50 parts, except that, it operated similarly to Example 1, and obtained the negative photosensitive The resin composition was evaluated in the same manner. Table 1 shows the results.

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Abstract

Provided is a negative-type photosensitive resin composition comprising a resin compound (A) having a weight-average molecular weight of at least 1000, a (meth)acryloyl compound (B), a silane-modified resin (C), a radical-generating photopolymerization initiator (D), and an epoxy group-containing crosslinking agent (E) which does not contain a silicon atom, wherein the resin compound (A) is provided with a resin compound (A1) having two or more (meth)acryloyl groups in each molecule and having a carboxyl group which reacts with the epoxy group, and the (meth)acryloyl compound (B) has a weight-average molecular weight less than 1000 and has two or more (meth)acryloyl groups in each molecule.

Description

technical field [0001] The present invention relates to a negative photosensitive resin composition and a resin film and an electronic component obtained by using the negative photosensitive resin composition. Negative photosensitive resin composition of a resin film excellent in pattern formability during development, and resin film and electronic component obtained using the negative photosensitive resin composition. Background technique [0002] Various resin films are provided in various display elements such as organic EL elements and liquid crystal display elements, integrated circuit elements, solid-state imaging elements, color filters, black matrices, and other electronic components to prevent deterioration or damage of these electronic components. Protective film, flattening film for flattening element surface or wiring, electric insulating film for maintaining electrical insulation, etc. In addition, a resin film is provided in an organic EL element as a pixel se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027C08G59/42G03F7/004G03F7/075
CPCG03F7/075G03F7/027G03F7/0757G03F7/004G03F7/035G03F7/0388C08G59/42G03F7/038
Inventor 田边彰洋
Owner ZEON CORP
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