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Circuit substrate and its preparation method

A technology of circuit substrate and dielectric constant, applied in the direction of circuit substrate material, printed circuit manufacturing, printed circuit, etc., can solve problems such as signal time delay without consideration

Active Publication Date: 2017-01-11
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] None of the above considers or proposes to solve the problem of signal delay in the plane direction of the circuit substrate, that is, the warp and weft directions, simply and conveniently in the conventional production process.

Method used

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  • Circuit substrate and its preparation method
  • Circuit substrate and its preparation method
  • Circuit substrate and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] Use E-type 1080 glass fiber cloth (mass per unit area is 46.8g / m 2 ) as a reinforcing material, the epoxy resin composition was dissolved in a solvent and then added with a filler as a pretreatment glue. Table 1 shows the composition of the glue formula and the physical properties of the circuit board. The steps for making the circuit board are as follows:

[0097] Step 1: Prepare pretreatment glue. Take a suitable container, add 40 parts by mass of epoxy resin composition, an appropriate amount of butanone solvent, stir for a certain period of time, then add 52 parts by mass of rutile titanium dioxide filler and 8 parts by mass of amorphous silica filler, and carry out Stir well, and emulsify and disperse to form the pretreatment glue. The Dk of the glue is 6.6.

[0098] Step 2: Prepare pretreated E-type glass fiber cloth. Use the above pretreatment glue to pre-impregnate the E-type glass fiber cloth, and dry the solvent after completion to obtain a pretreated glass...

Embodiment 2

[0102] Use E-type 1080 glass fiber cloth (mass per unit area is 46.8g / m 2 ) as a reinforcing material, the epoxy resin composition was dissolved in a solvent and then added with a filler as a pretreatment glue. Table 1 shows the composition of the glue formula and the physical properties of the circuit board. The steps for making the circuit board are as follows:

[0103] Step 1: Prepare pretreatment glue. Take a suitable container, add 42 parts by mass of epoxy resin composition, an appropriate amount of butanone solvent, stir for a certain period of time, then add 50 parts by mass of rutile titanium dioxide filler and 8 parts by mass of amorphous silica filler, and carry out Stir well, and emulsify and disperse to form the pretreatment glue, the glue Dk is 6.5.

[0104] Step 2: Prepare pretreated E-type glass fiber cloth. Use the above pretreatment glue to pre-impregnate the E-type glass fiber cloth, and dry the solvent after completion to obtain a pretreated glass fiber ...

Embodiment 3

[0108] Use E-type 1080 glass fiber cloth (mass per unit area is 46.8g / m 2 ) as a reinforcing material, the cyanate resin composition was dissolved in a solvent and then added with fillers as a pretreatment glue, the composition of the glue formula and the physical property data of the circuit board are shown in Table 1. The steps for making the circuit board are as follows:

[0109] Step 1: Prepare pretreatment glue. Take a suitable container, add 40 parts by mass of cyanate resin composition, an appropriate amount of butanone solvent, stir for a certain period of time, then add 54 parts by mass of rutile titanium dioxide filler and 6 parts by mass of amorphous silica filler, Thoroughly stir, emulsify and disperse to form the pretreatment glue, and the Dk of the glue is 6.5.

[0110] Step 2: Prepare pretreated E-type glass fiber cloth. Use the above pretreatment glue to pre-impregnate the E-type glass fiber cloth, and dry the solvent after completion to obtain a pretreated ...

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Abstract

The invention provides a method for preparing a bonding sheet for forming a circuit substrate, the method comprising using a pretreatment glue solution with a dielectric constant (Dk) that is the same as or close to the Dk value of the glass fiber cloth used to treat the glass fiber The cloth is pretreated. The invention also provides an adhesive sheet and a circuit substrate prepared by the method. The circuit substrate preparation method of the present invention does not require equipment modification and adjustment, and has low cost. The difference in dielectric constant between the warp direction and the weft direction of the prepared circuit substrate is smaller, and the problem of signal time delay can be effectively solved.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a circuit substrate and a manufacturing method thereof, in particular to a circuit substrate with microscopic uniformity and isotropy and a manufacturing method thereof, and more specifically to a dielectric constant in the warp direction. A circuit substrate with little difference from the weft direction and a manufacturing method thereof. Background technique [0002] In recent years, with the development of electronic products in the direction of multi-function and miniaturization, the circuit boards used are developing in the direction of multi-layer, high-density wiring and high-speed signal transmission. , such as the comprehensive performance of copper clad laminates put forward higher requirements. Specifically, the dielectric constant (Dk) and dielectric loss (Df) of the medium are important indicators that affect the signal transmission speed and signal qual...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/24C08J5/06C08L63/00C08L79/04C08L71/12C08L47/00C09J7/00B32B15/08B32B27/04H05K1/03
CPCC08J2323/20C08J2363/00C08J2371/12C08J2379/04H05K2201/029H05K1/0366C08J5/248C03C25/16C03C25/30C03C25/326C03C25/36H05K1/0306H05K1/0393H05K3/0011H05K3/0085
Inventor 颜善银曾宪平许永静杨中强苏晓声罗俐
Owner GUANGDONG SHENGYI SCI TECH