Light emitting diode encapsulating structure
A technology of light-emitting diodes and packaging structures, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of increased temperature control costs, bulky, inconvenient lamp design, etc., and achieve the effect of improving light output, excellent performance and ingenious design
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[0012] The structure diagram of the present invention is as figure 1 As shown, the light-emitting diode packaging structure of the present invention includes an LED bracket bowl 4, an LED chip 1 placed on the LED bracket bowl 4, and an LED bracket bowl 4 and an LED chip 1 placed on the LED bracket bowl 4. For potting protection, the LED chip 1 is connected to the LED metal lead wire 7, and the LED bracket cup and bowl 4 is connected to the bracket pin 5, wherein a phase change material is installed between the outside of the LED chip 1 and the outside of the transparent potting material 3 2. The phase change material 2 is a solid at normal temperature, but it is a transparent liquid when the LED chip 1 works stably.
[0013] In this embodiment, the phase change material 2 is poured on the outside of the LED chip 1 , the phase change material 2 seals and wraps the LED chip 1 , and the transparent potting material 3 seals and wraps the phase change material 2 and the LED chip 1 ...
Embodiment 2
[0024] Embodiment 2 of the present invention is similar to Embodiment 1. The difference between Embodiment 2 of the present invention and Embodiment 1 is that the phase-change material 2, taking paraffin wax as an example, can be sealed and packaged on the premise that the transparent potting material 3 can be guaranteed Next, instead of directly covering the surface of the LED chip 1 , the phase change material 2 is poured into any position between the transparent potting material 3 and the LED chip 1 .
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