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Laser welded glass heat pipe surface LED product and manufacturing method and equipment

A laser welding and glass heat pipe technology, applied in laser welding equipment, welding equipment, lighting and heating equipment, etc., can solve the problems of complex station equipment and excessively long soldering process, and achieve good air tightness and stable glass performance. , The effect of high laser stitch welding strength

Active Publication Date: 2016-08-17
广东力维电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if soldering is adopted, complicated station equipment is needed in order to prevent LED displacement during tin cooling and crystallization; and the soldering process is too long.

Method used

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  • Laser welded glass heat pipe surface LED product and manufacturing method and equipment
  • Laser welded glass heat pipe surface LED product and manufacturing method and equipment
  • Laser welded glass heat pipe surface LED product and manufacturing method and equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Relevant content of LED connection interface 15 can also refer to in embodiment 1 Figure 4 and Figure 5 Example 2. The content of Example 1 is also helpful for the understanding of Example 2.

[0030] Figure 4 and Figure 5A second embodiment of the present invention is collectively given.

[0031] Figure 4 and Figure 5 Among them, an LED circuit board 11 is pasted on the hot end of the glass heat pipe 1 . The LED circuit board 11 is provided with a conductive circuit 12 and an LED hole 19 for arranging the LED 2 . The LED connection interface 15 fabricated on the LED circuit board 11 adopts a thin stainless steel plate 26 on the circuit board with a thickness of 0.4 mm. A thermal insulation design is adopted between the LED connection interface 15 and the glass heat pipe 1 to reduce thermal shock and heat transfer to the glass heat pipe 1 . The contact surface between the LED 2 and the glass heat pipe 1 is coated with a thermally conductive adhesive mater...

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PUM

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Abstract

A glass heat tube surface LED laser welding method comprises the steps that an LED circuit board is arranged on a glass heat tube in a surface-mounting mode; a suction claw communicated with a negative pressure source is used for sucking an LED; the lower surface of the LED is glued; the LED is placed in a circuit board LED hole to be bonded with the glass heat tube so as to achieve low-thermal-resistance connection with the glass heat tube; stitch-welding flat pieces at the two ends of the LED are laminated on a stainless steel thin plate on the part, located at the edge of the LED hole, of the circuit board; the emitting end of a laser welding device is used for conducting stitch welding on the stitch-welding flat pieces and the stainless steel thin plate on the circuit board. The laser-welded LED, the LED circuit board, LED laser welding equipment and a heat tube LED lamp are manufactured through the method. The glass heat tube surface LED laser welding method can serve as an LED laser stitch welding method for industrial production of glass heat tube LED lamps, the laser welding time is short, welding is firm and can be realized at the normal temperature and impact on the wall of the glass heat tube is small in the welding process.

Description

technical field [0001] The invention relates to a product, a manufacturing method and equipment for laser welding an LED on the surface of a glass heat pipe. LED is the English abbreviation of laser light-emitting diode, which can be regarded as a professional term recognized in the technical field. Background technique [0002] Most of the existing electronic circuit boards use wave soldering. For LEDs that require heat transfer connection to the surface of the glass heat pipe, because the surface of the LED will be impacted by liquid tin, wave soldering is not suitable. In order to reduce thermal resistance, LEDs often need to be soldered after dispensing glue on the surface of the glass heat pipe. At this time, if soldering is adopted, in order to prevent the displacement of the LED during the tin cooling and crystallization process, complicated station equipment is required; and the soldering process is also too long. Contents of the invention [0003] The object of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/21B23K26/70F21K9/90F21V19/00F21V29/51F21Y115/10F21V29/503
CPCB23K26/211B23K26/244B23K26/32B23K26/702B23K2101/42B23K2103/50F21V17/101F21Y2101/00
Inventor 邱醒
Owner 广东力维电器有限公司