Cyanide-free one-step rapid copper plating process for steel wire surface

Abstract

The invention relates to a cyanide-free one-step rapid copper plating process for a steel wire surface. The cyanide-free one-step rapid copper plating process is characterized in that the electroplating solution is obtained by mainly mixing 150-300 g / L of copper sulfate, 5-16 mL / L of glycerol, 15-40 g / L of sulfuric acid, 50-100 g / L of a mixture of amino trimethylene phosphonic acid and 2-mercaptobenzimidazole, and 10-40 g / L of ammonium citrate, the cathode current density during electroplating is 35-50 A / dm<2>, and the temperature is 50-60 DEG C. According to the present invention, pre-plating is not required, the copper layer can be formed at a high speed, and the uniform, bright and delicate plating layer with good binding force can be obtained.

Description

technical field [0001] The invention relates to the field of cyanide-free copper plating, in particular to a cyanide-free one-step rapid copper plating process on the surface of steel wires. Background technique [0002] Copper plating is one of the main processes for surface treatment of steel wire. Its usage in the metal products industry is second only to galvanizing, but its purpose and function are more extensive and important than galvanizing. In addition to its anti-corrosion and decorative functions like galvanizing, it is sometimes used to improve the electrical conductivity of the steel wire, sometimes to increase the lubricating performance of the steel wire when it is further drawn, sometimes to increase the bonding strength of the steel wire and rubber, and sometimes It is to facilitate the implementation of tin plating and silver plating on it. With the rapid development of science and technology and modern industry, steel wire copper plating technology has als...

AI Technical Summary

Problems solved by technology

For steel wire pre-nickel plating, if it only takes less than one minute to apply the plating layer, it must be riddled with holes. The hole directly reaches the surface of the steel substrate, so the substitution reaction is very easy to occur, resulting in pitting of the copper coating, which affects the quality of the copper plating of the steel wire