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Curable resin composition, its sheet, molded body, semiconductor package, semiconductor component, and light-emitting diode

A technology of light-emitting diodes and curable resins, applied in semiconductor/solid-state device parts, semiconductor devices, electric solid-state devices, etc., can solve the problems of reduced fluidity, reduced resin strength, and damage to molding processability, etc., to achieve low linear expansion coefficient, reduced warpage, and excellent toughness

Inactive Publication Date: 2018-08-24
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a large amount of inorganic filler is filled in order to reduce the linear expansion, the flowability of the resin during molding is reduced and the molding processability is impaired. Therefore, there is a limit to this method. In addition, when the modulus of elasticity is reduced, the strength of the resin is reduced, which impairs the performance of the resin. Main functions of packages that protect semiconductor devices

Method used

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  • Curable resin composition, its sheet, molded body, semiconductor package, semiconductor component, and light-emitting diode
  • Curable resin composition, its sheet, molded body, semiconductor package, semiconductor component, and light-emitting diode
  • Curable resin composition, its sheet, molded body, semiconductor package, semiconductor component, and light-emitting diode

Examples

Experimental program
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Effect test

Embodiment

[0411] Hereinafter, examples and comparative examples of the present invention are shown, but the present invention is not limited by the following contents.

Synthetic example 1

[0413] 200 g of toluene and 50 g of 1,3,5,7-tetramethylcyclotetrasiloxane were placed in a 500 mL four-necked flask, and the gas phase was replaced with nitrogen, followed by heating and stirring at an internal temperature of 105°C. Add 11.0 g of diallyl monoglycidyl isocyanurate, 11.0 g of toluene, and 0.0162 g of a xylene solution (containing 3% by weight as platinum) of vinylsiloxane-platinum complex dropwise over 30 minutes. Mixture. After 6 hours from the end of the dropwise addition, by 1 H-NMR confirmed that the reaction rate of the allyl group was 95% or more, and the reaction was terminated by cooling. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure to obtain a colorless and transparent liquid. pass 1 H-NMR measurement shows that this liquid is a part of SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane reacted with diallyl monoglycidyl isocyanurate and has the following properties: structured matter. In addi...

Synthetic example 2

[0417] A stirring device, a dropping funnel, and a condenser were installed in a 5 L four-necked flask. 1,800 g of toluene and 1,440 g of 1,3,5,7-tetramethylcyclotetrasiloxane were placed in the flask, and heated and stirred in a 120° C. oil bath. A mixed solution of 200 g of triallyl isocyanurate, 200 g of toluene, and 1.44 ml of a xylene solution (containing 3% by weight as platinum) of a vinylsiloxane-platinum complex was added dropwise over 50 minutes. After heating and stirring the obtained solution for 6 hours as it was, unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure. pass 1 H-NMR measurement revealed that this liquid had the following structure obtained by reacting some SiH groups of 1,3,5,7-tetramethylcyclotetrasiloxane and triallyl isocyanurate.

[0418] [chemical formula 20]

[0419]

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PUM

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Abstract

An object of the present invention is to provide a curable composition capable of obtaining a tough cured product having a low linear expansion coefficient. The curable resin composition of the present invention is characterized by containing the following as essential components: (A) Silicon containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule and having a molecular weight of less than 1,000 Compound; (B) A compound containing at least 2 SiH groups in 1 molecule; (C) Hydrosilylation catalyst; (D) A compound containing at least 1 carbon-carbon double bond reactive with SiH groups in 1 molecule, An organic silicon compound with a molecular weight of 1000 or more; and (E) inorganic filler material.

Description

technical field [0001] The present invention relates to a curable resin composition, a curable resin composition sheet, a molded body, a semiconductor package, a semiconductor component, and a light-emitting diode. Background technique [0002] Conventionally, packages using curable resins in various shapes have been used in semiconductors. In such a package, in order to electrically connect the semiconductor to the outside of the package, to maintain the strength of the package, or to conduct heat generated by the semiconductor to the outside of the package, various metal materials are used, and they are often integrally molded with a curable resin. . [0003] However, the linear expansion coefficient of resin is generally large, and it is difficult to match the linear expansion coefficient with metal materials, which generally have a small linear expansion coefficient. Therefore, various heating-cooling is required during thermoforming, post-curing, or use as a semiconduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08K5/5425B29C45/02B29C45/14C08J3/12H01L23/29H01L23/31H01L33/48
CPCH01L23/296B29C45/0001B29C45/14655C08G77/12C08G77/14C08G77/20C08G77/54C08K5/5425C08K5/56C08L83/04C08L83/14H01L33/48H01L2924/0002C08L83/00H01L2924/00
Inventor 井手正仁高木直人金井和章尾崎修平大越洋射场聪明平林和彦岩原孝尚
Owner KANEKA CORP